Company patents

Nubis Communications, Inc.

Nubis Communications, Inc. surprisingly shows a shifting priority away from its core "Optical Elements & Systems" category, which constitutes 67.1% of its portfolio but has seen a significant 84.6% decline in patent filings so far in 2026. This contrasts with a more stable, albeit smaller, focus on "Printed Circuits & Electronic Assemblies," which represents 28.6% of its portfolio and has seen a more moderate 20.0% decline in filings so far this year.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

70 US filings (since 2023) · 4 categories · 5 themes

Photonic Integration & Interconnects

The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.

Optical Elements & Systems
Who else files here? →
40since 2023
-14.3%YoY
Optical Fiber Sensing Systems

Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.

Optical Elements & Systems
Who else files here? →
23since 2023
-22.2%YoY
Advanced Electronic Packagingfiltered

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
Who else files here? →
22since 2023
-50.0%YoY
Optical Polarization Management

Methods and devices for controlling, detecting, and compensating for the polarization state of light signals in optical communication systems, crucial for reducing crosstalk and managing signal integrity.

Multiplex Communication
Who else files here? →
18since 2023
-25.0%YoY
Optical Wavelength Division Multiplexing

Techniques for combining and separating multiple optical signals at different wavelengths over a single optical fiber, including components like filters, comb sources, and tunable add/drop multiplexers.

Multiplex Communication
Who else files here? →
12since 2023
-33.3%YoY

Patents

Page 1 of 3
US 20260082503 A1APPLICATION
H05K7/14

THERMAL DESIGN FOR RACK MOUNT SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

Filed:2025-11-24Pub:2026-03-19
Applicant:Nubis Communications, Inc.

An apparatus includes a rackmount device, in which the rackmount device includes a housing configured to be installed in a server rack, in which the housing has a width in a range from 16 to 20 inches and a height in a range from 1 to 12 inches, the housing includes a front panel, a rear panel, and a bottom surface. The rackmount device includes a first circuit board or substrate having a first surface that defines a length and a width of the first circuit board or substrate, in which the first circuit board or substrate is positioned relative to the housing such that the first surface of the first circuit board or substrate is at an angle relative to the bottom surface of the housing, and the angle is in a range from 45° to 90°. At least one of (i) the front panel of the housing is formed at least in part by the first circuit board or substrate, (ii) the first circuit board or substrate is attached to the front panel of the housing, or (iii) the first circuit board or substrate is substantially parallel to the front panel of the housing. The rackmount device includes at least one data processor electrically coupled to the first circuit board or substrate and configured to process data; and at least one optical/electrical communication interface coupled to the first circuit board or substrate and configured to convert received optical signals to electrical signals that are provide to the at least one data processor. The rackmount device includes at least one of (i) at least one inlet fan attached to the front panel of the housing, or (ii) at least one fan positioned near the front panel in which at least a portion of a fan blade of the at least one fan is within a first distance from the front panel for at least some time period during operation of the at least one fan, and the first distance is less than one-fourth of a second distance between the front panel and the rear panel.

US 12520448 B2GRANTED
H05K7/14

Thermal design for rack mount systems including optical communication modules

Filed:2021-11-19Pub:2026-01-06
Applicant:Nubis Communications, Inc.

An apparatus includes a rackmount device, in which the rackmount device includes a housing configured to be installed in a server rack, in which the housing has a width in a range from 16 to 20 inches and a height in a range from 1 to 12 inches, the housing includes a front panel, a rear panel, and a bottom surface. The rackmount device includes a first circuit board or substrate having a first surface that defines a length and a width of the first circuit board or substrate, in which the first circuit board or substrate is positioned relative to the housing such that the first surface of the first circuit board or substrate is at an angle relative to the bottom surface of the housing, and the angle is in a range from 45° to 90°. At least one of (i) the front panel of the housing is formed at least in part by the first circuit board or substrate, (ii) the first circuit board or substrate is attached to the front panel of the housing, or (iii) the first circuit board or substrate is substantially parallel to the front panel of the housing. The rackmount device includes at least one data processor electrically coupled to the first circuit board or substrate and configured to process data; and at least one optical/electrical communication interface coupled to the first circuit board or substrate and configured to convert received optical signals to electrical signals that are provide to the at least one data processor. The rackmount device includes at least one of (i) at least one inlet fan attached to the front panel of the housing, or (ii) at least one fan positioned near the front panel in which at least a portion of a fan blade of the at least one fan is within a first distance from the front panel for at least some time period during operation of the at least one fan, and the first distance is less than one-fourth of a second distance between the front panel and the rear panel.