Company patents

NuFlare Technology, Inc.

NuFlare Technology, Inc. maintains a strong focus on core semiconductor technologies, with Electron / Ion Tubes & Discharge comprising 68.8% of its portfolio, despite a significant -51.9% decline in patenting activity so far in 2026. Surprisingly, while its primary categories show fluctuating or declining trends, Photolithography is emerging as a renewed focus, experiencing a robust +50.0% growth in patent filings so far in 2026 after two years of decline.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

266 US filings (since 2023) · 7 categories · 14 themes

Ion Implantation Control & Metrology is up +24.4% YoY. Worth a look.
Ion Implantation Control & Metrology

Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.

Electron / Ion Tubes & Discharge
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174since 2023
+24.4%YoY
Charged Particle Beam Optics

Techniques and devices for generating, shaping, focusing, and deflecting electron or ion beams, often involving multi-pole lenses, deflectors, and aberration correction for applications like microscopy or processing.

Electron / Ion Tubes & Discharge
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167since 2023
+15.0%YoY
Advanced Etching & Patterning Controlfiltered

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Semiconductor Manufacturing Process
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135since 2023
+30.0%YoY
Lithography Metrology & Inspection

Techniques and apparatus for measuring critical dimensions, overlay accuracy, defect detection, and surface topography in lithographic processes, often involving optical, laser, or charged particle beams.

Photolithography
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44since 2023
-8.3%YoY
Automated Visual Inspection

Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.

Material & Chemical Analysis
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29since 2023
-12.5%YoY
Wafer Handling and Process Environment Control

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Semiconductor Manufacturing Process
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15since 2023
+800.0%YoY
Substrate Patterning & Processing

Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.

Photolithography
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14since 2023
+200.0%YoY
Conformal & Selective Film Deposition

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Coating & Surface TreatmentSemiconductor Manufacturing Process
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12since 2023
+300.0%YoY
Advanced Deposition Chamber Hardware

Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.

Coating & Surface Treatment
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8since 2023
-25.0%YoY
RF Plasma Power Delivery

Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.

Electron / Ion Tubes & Discharge
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7since 2023
n/a
Plasma Process Chamber Engineering

Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.

Electron / Ion Tubes & Discharge
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6since 2023
0.0%YoY
Advanced Mask Technologies

Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.

Photolithography
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4since 2023
0.0%YoY
EUV Lithography Systems

Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.

Photolithography
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2since 2023
new
Vacuum System & Chamber Evacuation

Techniques and apparatus for achieving and maintaining vacuum conditions within charged particle and plasma processing chambers, including pump control, vacuum degree monitoring, and chamber sealing.

Electron / Ion Tubes & Discharge
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1since 2023
n/a

Patents

Page 20 of 22
US 20210241995 A1APPLICATION
H01J37/317

CHARGED PARTICLE BEAM WRITING APPARATUS, CHARGED PARTICLE BEAM WRITING METHOD, AND A NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM

Filed:2021-04-21Pub:2021-08-05
Applicant:NuFlare Technology, Inc.

Position shifts caused by charging phenomena can be corrected with high accuracy. A charged particle beam writing apparatus includes an exposure-amount distribution calculator calculating an exposure amount distribution of a charged particle beam using a pattern density distribution and a dose distribution, a fogging charged particle amount distribution calculator calculating a plurality of fogging charged particle amount distributions by convoluting each of a plurality of distribution functions for fogging charged particles with the exposure amount distribution, a charge-amount distribution calculator calculating a charge amount distribution due to direct charge using the pattern density distribution, the dose distribution, and the exposure amount distribution, and calculating a plurality of charge amount distributions due to fogging charge using the plurality of fogging charged particle amount distributions, a position shift amount calculator calculating a position shift amount of a writing position based on the charge amount distribution due to direct charge and the plurality of charge amount distributions due to fogging charge, a corrector correcting an exposure position using the position shift amount, and a writer exposing the corrected exposure position to a charged particle beam.