Company patents
NuFlare Technology, Inc.
NuFlare Technology, Inc. maintains a strong focus on core semiconductor technologies, with Electron / Ion Tubes & Discharge comprising 68.8% of its portfolio, despite a significant -51.9% decline in patenting activity so far in 2026. Surprisingly, while its primary categories show fluctuating or declining trends, Photolithography is emerging as a renewed focus, experiencing a robust +50.0% growth in patent filings so far in 2026 after two years of decline.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
266 US filings (since 2023) · 7 categories · 14 themes
Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.
Techniques and devices for generating, shaping, focusing, and deflecting electron or ion beams, often involving multi-pole lenses, deflectors, and aberration correction for applications like microscopy or processing.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Techniques and apparatus for measuring critical dimensions, overlay accuracy, defect detection, and surface topography in lithographic processes, often involving optical, laser, or charged particle beams.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.
Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.
Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.
Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.
Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.
Techniques and apparatus for achieving and maintaining vacuum conditions within charged particle and plasma processing chambers, including pump control, vacuum degree monitoring, and chamber sealing.
Patents
Showing 191-200 of 215
Advanced Etching & Patterning Control