Company patents
Oki Electric Industry Co., Ltd.
Oki Electric Industry Co., Ltd. surprisingly maintains a strong focus on Electrography (Xerography), which constitutes 50.4% of its total patent portfolio, despite a significant decline of 72.2% in patent filings so far in 2026 compared to 2025. This suggests a shifting priority away from its core imaging technology, alongside a complete cessation of new patent filings in LED & Optoelectronics (Legacy CPC) and Printed Circuits & Electronic Assemblies so far in 2026, indicating a broader re-evaluation of its technology investments.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
131 US filings (since 2023) · 12 categories · 17 themes
Systems and methods for controlling temperature within image forming apparatuses, particularly for fixing devices, and during printer operation or shutdown, to ensure optimal performance, energy efficiency, and component longevity.
Techniques and apparatuses for enabling specialized printing applications beyond standard color reproduction, such as forming toner images specifically for adhering foil onto sheets.
Mechanisms and control systems for reliably feeding, conveying, and separating print media, including managing media roll changes, adjusting airflow, and adapting to different media characteristics.
Advancements in the structure, materials, and electrical characteristics of electrophotographic photosensitive members, focusing on photosensitive layers, conductive supports, protection layers, and their impedance properties.
Systems that perform operations like cutting, folding, binding, or applying liquids to sheets or webs, often integrated within larger production lines such as printing or image forming apparatuses.
Systems and methods for maintaining and improving the quality of printed images, encompassing adjustments to developing bias based on environmental conditions, paper characteristic detection, and color profile generation.
Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.
Innovations in the internal design of individual light-emitting diode chips or packages, focusing on semiconductor layer arrangements, electrode configurations, reflective elements, and light extraction features.
Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.
Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.
Advanced sensing techniques leveraging quantum phenomena or highly sensitive optical methods, often involving interferometry, squeezed states, or exceptional points, to achieve enhanced measurement sensitivity for physical parameters.
Integration of optical sensors, particularly for biometrics or other surface interactions, beneath a display or protective cover, requiring specialized optical paths, illumination, and packaging.
Focuses on the design, fabrication, and application of piezoelectric materials and devices for sensing, actuation, or wave generation, including material properties, single crystal growth, and protective layers.
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Innovations in the chemical and physical properties of toner particles, including binder resins, waxes, colorants, and inorganic additives, to optimize performance, production, and environmental characteristics.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Patents
Showing 1-10 of 236