PI Advanced Materials Co., Ltd.

The present invention provides a black polyimide film manufactured by imidizing a polyamic acid obtained from dianhydride monomers and diamine monomers, the black polyimide film comprising: a black pigment containing bituminous coal and perylene black.

The present disclosure provides a polyamic acid composition comprising: a polyamic acid including a dianhydride monomer and a diamine monomer as polymerization units; and an additive containing imidazole, wherein the additive has an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the polyamic acid.

The present invention provides polyimide varnish comprising: polyamic acid comprising, as a polymerization unit, at least one dianhydride monomer and at least one diamine monomer; nano silica surface-modified with an organosilane; a silicone-based additive represented by Chemical Formula 1; and an organic solvent.

Provided is a polyimide varnish comprising: polyamic acid and nanosilica, wherein the nanosilica contains 5 to 23 wt % relative to the solid content of the polyamic acid, and the polyimide varnish has an absolute value of zeta potential of 1 to 30 mV.

The present invention provides: a polyimide film having excellent dimensional stability; and a method for manufacturing same, wherein the polyimide film has a coefficient of thermal expansion of 1 ppm/° C. to 5 ppm/° C., an elastic modulus of 9 GPa to 11.5 GPa, and a glass transition temperature of 340° C. to 400° C.

The present invention provides a polyamic acid composition comprising a dianhydride monomer and a diamine monomer as polymerization units, wherein the diamine monomer comprises a first diamine monomer, a second diamine monomer, and a third diamine monomer, the second diamine monomer is a flexible diamine monomer having three or more benzene rings, and the third diamine monomer is represented by Chemical Formula 1. The polyamic acid composition of the present disclosure may have excellent adhesion and adherence to wires h as copper, and thus may have excellent usability as an insulating coating material for an electric wire, etc.

The present application provides a polyimide precursor capable of simultaneously realizing a low dielectric constant, light resistance, heat resistance, insulation, and mechanical properties under harsh conditions, such as high temperatures, by including a high-molecular-weight polyamic acid, a method of preparing the polyamic acid, a method of increasing a molecular weight of the polyamic acid, a film including the precursor, and a display device having the film attached to a substrate.

The present invention provides a polyimide film and a manufacturing method therefor, wherein the polyimide film satisfies the following equation (1) as measured for dimensional change by a thermomechanical analyzer (TMA) undergoing a temperature elevation process from 25° C. to 400° C. and then a cooling process from 400° C. to 25° C. Equation (1) dimensional measurement in TD direction (cooling, 50° C.)−dimensional measurement in TD direction (temperature elevation, 50° C.)<0 μm.

Disclosed herein are a polyimide film for graphite sheets, a method of fabricating the same, and a graphite sheet fabricated using the same. The polyimide film is fabricated by imidizing a polyamic acid formed by reaction between a dianhydride monomer and a diamine monomer, wherein the reaction is carried out in the presence of a metal compound and the polyamic acid forms a chelate with metal ions.

The present invention provides a polyimide film and a manufacturing method therefor, wherein in the dimension change measurement by a thermomechanical analyzer (TMA) that performs a temperature rise procedure from 25° C. to 400° C. after storage for 48 hours at a humidity of 50% RH, the temperature-rise thermal expansion coefficient (50 to 200° C.) in the TD direction is −1.5 ppm/° C. to 6 ppm/° C., the temperature-rise thermal expansion coefficient (50 to 200° C.) being the slope of a straight line connecting a dimensional measurement value in the TD direction of the polyimide film as measured at 200° C. in the first run during the temperature rise procedure and a dimensional measurement value in the TD direction of the polyimide film as measured at 50° C. in the first run during the temperature rise procedure, and the dimensional measurement values in the TD direction correspond to dimensional change values calculated by converting, into 1 m, the length of a sample of the polyimide film used in the measurement by the thermomechanical analyzer.