POINT ENGINEERING CO., LTD.

Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.

Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.

Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.

Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.

Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Application of protective layers to improve the durability and longevity of components by enhancing resistance to wear, oxidation, or chemical degradation in demanding operational environments.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.

Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.

Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.

Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.

Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.