Precitec GmbH & Co. KG

A laser machining system for machining a workpiece by a laser beam. The laser machining system includes a laser machining head with at least one focusing optics for focusing the laser beam so that the workpiece is heated and process emission occurs; at least four optical sensors; and a control device. The optical sensors are insensitive to radiation having the wavelength of the laser beam and the optical sensors are each arranged to sense the process emission in at least one wavelength range that does not include the wavelength of the laser beam and to generate a respective sensor signal based thereon. The control device is configured to monitor the machining of the workpiece based on the mean value of the sensor signals.

A nozzle unit that lateral shields gas supply for a laser machining head. The nozzle unit includes a shielding gas nozzle, a holding device to which the shielding gas nozzle is attached, and an adapter for attaching the holding device to the laser machining head. The holding device and the adapter are detachably coupled to each other by magnetic force.

A method and a laser processing system are for laser processing a workpiece by a laser beam. The method includes: recording an image of the workpiece with a camera, the beam path of which is coaxially coupled into a beam path of the laser beam and runs together with the beam path of the laser beam via a scanning device; determining a respective contour point for each measuring line of a plurality of measuring lines which are laid through an expected contour path of the workpiece in the recorded image; determining an actual contour path of the workpiece based on the determined contour points; and controlling the scanning device for positioning the laser beam for laser processing based on the actual contour path.

A method for determining a depth of a vapor capillary during laser machining includes: irradiating a machining laser beam onto a workpiece to form the capillary, the beam deflected by a first deflection device along a machining path within a first scan field, irradiating an optical measuring beam onto the workpiece, the measuring beam deflected by a second deflection device relative to the machining laser beam along a scanning path within a scanning area and then together with the machining laser beam by the first deflecting device, acquiring measured distance values along the path based on part of the measuring beam reflected by the workpiece, determining a depth/position of the capillary based on the acquired measured distance values. The scanning area size is based on a position of the laser beam and/or deflection of the laser beam by the first deflection device. A corresponding laser machining system is also provided.

A sensor device for monitoring a laser machining process is provided. The sensor device includes at least one filter module for filtering a process beam generated during the execution of the laser machining process, and a sensor unit for detecting an intensity of the filtered process beam in at least two measurement channels by at least two photosensors. The filter module is configured to adjust at least one partial wavelength range of the process beam that is detectable in one of the measurement channels of the sensor unit. A laser machining system with the sensor device is also provided.

A sensor device for monitoring a laser machining process by a laser beam by sensing an intensity of a process beam, the sensor device includes: an optical input; a beam splitter arrangement configured to couple out a plurality of visible partial beams with a respective visible wavelength range from the process beam; a first photosensor arrangement for sensing the intensity of the process beam in the visible wavelength range with a plurality of photosensors arranged to respectively sense an intensity of one of the visible partial beams, the beam splitter arrangement is configured to couple out a first visible partial beam with a first visible wavelength range, a second visible partial beam with a second visible wavelength range, a third visible partial beam with a third visible wavelength range, and a fourth visible partial beam with a fourth visible wavelength range to one photosensor of the first photosensor arrangement, respectively.

A method for determining a quality criterion of a welded connection between two conductor ends. The method includes acquiring intensity information of a plurality of image points and depth information of the plurality of image points of an acquisition area covering the two conductor ends, and determining a quality criterion as a function of the intensity information acquired and the depth information acquired.

A method for analyzing a weld seam formed by a laser welding process includes thermally exciting the weld seam by radiating at least one laser pulse onto the weld seam, acquiring a decay characteristic of a thermal radiation emitted by the weld seam, and determining whether a welding defect is present based on an evaluation of the acquired decay characteristic.

A wire guide device for a laser processing head for deposition welding by a laser beam has a plurality of guide parts arranged in succession to guide a welding wire. Two of the guide parts are movably coupled to each other by a coupling element. A second guide part of the two guide parts is displaceable and/or tiltable relative to a first guide part of the two guide parts.

A method for monitoring a laser machining process for machining workpieces includes: for a plurality of machining steps, detecting a measurement signal for at least one measurement variable during a machining step; in a setting phase, defining a limit value for at least one monitoring parameter based on the measurement signals detected during the setting phase; and in a monitoring phase, determining a monitoring parameter value for each machining step based on the measurement signal, comparing the monitoring parameter value with the limit value to identify a faulty machining step, and determining whether a process change condition is met based on the measurement signal of at least one machining step. After a predefined setting time interval or number of machining steps during the setting phase, switching from the setting to monitoring phase, and switching back from the monitoring to setting phase when the process change condition is met.