Company patents
PsiQuantum, Corp.
PsiQuantum, Corp. exhibits a surprising patent strategy, with a significant focus on core quantum computing enablers like Liquid Crystal & Optical Modulators (28.8% of portfolio) and Optical Elements & Systems (28.4% of portfolio), both showing strong growth in 2025 (+57.9% and +63.2% respectively) after a dip in 2024. While Machine Learning & AI saw a remarkable 100.0% YoY growth in 2024, its subsequent decline in 2025 and 2026 (so far) suggests a shifting priority, contrasting with the emerging focus on Cables & Conductors, which experienced a 150.0% YoY growth so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
285 US filings (since 2023) · 12 categories · 18 themes
Specialized digital and mixed-signal circuits for controlling and reading out quantum bits (qubits), including generating precise modulated RF signals and integrating with photonic components for quantum operations.
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Developing and applying machine learning algorithms that leverage quantum computing principles, such as quantum circuits or autoencoders, for tasks like simulation or data processing.
Devices leveraging superconductivity or quantum phenomena for applications such as quantum computing, high-efficiency power transmission, or sensitive detection, including materials like graphene Josephson junctions and quantum bits.
Innovations in the physical design, materials, fabrication, or packaging of photodetectors and optical sensor elements, including thermoelectric, NIR-compliant, and self-mixing interference types, to improve performance or integration.
Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.
Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Development of new conductive materials, including powders, composites, and alloys, designed for specific electrical performance, manufacturing processes, or applications beyond basic copper wires.
Focuses on the design, fabrication, and application of piezoelectric materials and devices for sensing, actuation, or wave generation, including material properties, single crystal growth, and protective layers.
Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.
Techniques for driving electrophoretic displays, including managing remnant voltage, optimizing particle movement, and specific addressing pulse schemes to improve optical quality and update speed.
Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.
Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Design and integration of thermoelectric modules for converting heat into electricity (power generation) or using electricity for cooling/heating, often involving p-type/n-type semiconductor pellets and waste heat recovery.
Patents
Showing 1-10 of 27
Resistive & Phase Change Memory