QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD

A packaging substrate includes a circuit board defining a through groove. The circuit board includes an insulating body and a first wiring layer formed on the insulating body. A colloid is formed in the through groove. The packaging substrate further includes at least one lead. Each lead includes a lead body and a lead terminal connected to an end of the lead body. The lead terminal protrudes from the colloid. Another end of the lead body away from the lead terminal is electrically connected to the circuit board, and the colloid covering the lead body.

A method for manufacturing a multilayer circuit board includes providing an inner circuit substrate defining a through hole, attaching a support plate to the inner circuit substrate to seal an opening of the through hole; placing an electronic module in the through hole; pressing a first substrate onto a surface of the inner circuit substrate; removing the support plate; pressing a second substrate onto another surface of the inner circuit substrate, the first substrate and the second substrate infilling the through hole and jointly encapsulating the electronic module; forming a first conductive wiring layer on a surface of the first substrate facing away from the first surface to obtain a first circuit substrate, and forming a second conductive wiring layer on a surface of the second substrate facing away from the second surface to obtain a second circuit substrate. A multilayer circuit board is also disclosed.

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

A bio-implantable device and a fabricating method of the same are provided. The bio-implantable device includes a flexible circuit board, a sensor, an elastic conductive layer, an electrode structure, and an elastic insulating layer. The flexible circuit board includes a wiring layer. The sensor is disposed on the wiring layer. The elastic conductive layer covers the sensor. The electrode structure is disposed on the elastic conductive layer and is configured to collect an electric signal from a creature. The electrode structure is electrically connected to the sensor through the elastic conductive layer. The elastic insulating layer covers the flexible circuit board and exposes the electrode structure and the elastic conductive layer.

A pressure sensor and method of manufacturing the same are provided. The pressure sensor includes a flexible sensor board. The flexible sensor board includes a dielectric layer, two circuit layers and piezoelectric sensing blocks. The dielectric layer has a first surface and a second surface opposite to the first surface. The two circuit layers are placed on the first surface and the second surface of the dielectric layer respectively. The piezoelectric sensing blocks are placed in dielectric layer and electrically connected with the two circuit layers. The mentioned pressure sensor utilizes the flexible sensor board that can be suitable for to the curvature of the diffident curved surfaces of the tested sample, which helps to improve the consistency and accuracy of the measurements.

A radio frequency transmission circuit board has a bending portion, a signal transmitting portion and a signal receiving portion, and includes a first multilayer structure, a second multilayer structure, a third multilayer structure, a blind hole, a lens and an optical fiber. The blind hole extends from the second multilayer structure to the first multilayer structure. A reflective layer is arranged in the blind hole. The lens is embedded in the first multilayer structure and partially exposed in the blind hole. The optical fiber is embedded in the first multilayer structure and connected to the lens. The bending portion does not include the second multilayer structure and the third multilayer structure. The blind hole and the lens are located in the signal transmitting portion. The optical fiber is located in the bending portion.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

A circuit board includes a first wiring substrate, a second wiring substrate, a channel, a first electronic component, a second electronic component and a sealing material layer. The first wiring substrate includes a first wiring layer and a second wiring layer. The second wiring substrate is disposed on one side of the first wiring substrate. The channel extends through the first wiring substrate and the second wiring substrate. The first electronic component is disposed in the channel and is electrically connected to the first wiring layer. The second electronic component is disposed in the channel and is electrically connected to one of the first wiring layer and the second wiring layer. The sealing material layer fills the channel and covers the first electronic component and the second electronic component.

A multilayered flexible flat cable includes at least two cable units. Each of the cable units includes a plurality of wires, two insulating films, a plurality of detecting elements, a plurality of crimping terminals and a plurality of cut-off holes. The wires are arranged in parallel between the two insulating films. The detecting elements are respectively electrically connected to the wires. The crimping terminals are respectively crimped to the wires, and the crimping terminals are respectively electrically connected to the wires. The cut-off holes are respectively extended through one of the two insulating films and the wires. One of the two insulating films of one of the cable units is attached to one of the two insulating films of another one of the cable units.

The present application provides a pressure-sensitive circuit board, including a circuit substrate, a number of conductive convex blocks, and a strain member. The circuit substrate includes a dielectric layer and a conductive wiring layer on the dielectric layer. The conductive convex blocks are spaced from each other on the conductive wiring layer. A receiving space is defined between adjacent conductive convex blocks. The strain member is formed on the conductive convex blocks and covers the receiving space. The strain member can be deformed under an external force. The receiving space can receive at least a portion of the strain member. The present application further provides a manufacturing method for the pressure-sensitive circuit board. The present application further provides a pressure sensor.