Resonac Corporation

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.

Synthesis and formulation of polymers, such as epoxy resins, polyimides, or ionic binders, tailored for specific functions in electronic components like sealing, insulation, or energy storage.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Polymer compositions engineered for enhanced heat resistance, thermal stability in molten states, or improved processability at high temperatures, often involving specific copolymers, blends, or stabilizing additives for applications in electronics or automotive.

Development of novel material compositions, thin-film deposition techniques, and surface treatments for recording layers, lubricants, and protective coatings to improve data density, durability, and magnetic or optical properties.

Polymer compositions incorporating inorganic or organic filler materials to impart specific functional properties such as thermal conductivity, flame retardancy, electrical conductivity, or enhanced mechanical strength and dimensional stability.

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Processes involving chemical and mechanical forces to planarize surfaces (CMP) or wet chemical treatments for cleaning, etching, or material removal, often utilizing specialized compositions, nozzles, or fluid management systems.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Novel formulations and mechanisms for initiating or controlling the polymerization and cross-linking of adhesives, including dual-curing systems, radical polymerization, and partial curing for tailored material properties.

Light-initiated polymerization processes used to create structures, coatings, or components, particularly for electronic devices, displays, or additive manufacturing, often involving photoinitiators and specific monomer/oligomer compositions.

Development of adhesive compositions that are applied in a molten state and solidify upon cooling, focusing on specific polymer blends, additives, and their resulting mechanical or optical properties.

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Additives or compositions specifically formulated for surface application or modification to impart protective, decorative, or specialized functional properties to polymer products.

Adhesive compositions specifically formulated to bind active materials within battery electrodes, emphasizing properties like electrolyte resistance, adhesion to current collectors, and processability for manufacturing.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Materials added to polymers to modify their thermal transfer properties, typically increasing conductivity for heat dissipation in applications like electronics or battery packs.

Methods and catalyst systems, often supported (e.g., on silica or alumina), for the synthesis of polyolefins like polyethylene and polypropylene, focusing on controlling molecular weight, distribution, and polymer morphology.

Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.

Techniques for manufacturing thin polymer layers, sheets, or multi-layer structures, often optimized for specific properties such as flexibility, barrier function, filtration, or mechanical strength.

Substances incorporated into polymer systems to control or enhance adhesive properties, cross-linking reactions, or processing characteristics such as mold release and flow.

Methods for synthesizing polyurethanes and polyureas, including non-isocyanate routes, using various monomers, catalysts, and curing agents, often for foams, coatings, or adhesives.

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

Development and application of polymer compositions designed for reprocessability, recyclability, or incorporating sustainable additives, often featuring reversible bonds or bio-based components.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Adhesive technologies focused on environmental benefits such as biodegradability, natural origin, or designed for easy debonding and re-bonding to facilitate recycling, reuse, or specific application needs.

Innovations in the mechanical and electromagnetic design of read/write heads, sliders, suspension assemblies, and actuator systems for hard disk drives, focusing on precision, stability, and data integrity.

Polymer compositions tailored for medical and biological applications, including implantable devices, drug delivery systems, and diagnostic tools, emphasizing properties like biocompatibility, hydrolysis resistance, optical clarity, and specific mechanical characteristics.

Development of rubber and elastomer compositions, often involving specific polymer blends, additives (e.g., process oils, reinforcing agents), and cure packages, to achieve desired mechanical properties like abrasion resistance, wet grip, shear durability, or flexibility for demanding applications.

Synthesis and modification of polysiloxane polymers to introduce specific functional groups or structures, enhancing properties for applications like composites, coatings, biomedical uses, or powder treatment.

Advanced control algorithms and embedded systems for managing hard disk drive operations, including precise head positioning, track following, defect detection, command scheduling, and thermal management.

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Synthesis and modification of high-performance thermoplastic polymers, such as poly(arylene ether ketone) (PAEK) or polycarbonates, to achieve enhanced thermal stability, mechanical strength, or specific processing characteristics.

Synthesis and formulation of epoxy resins, often derived from phenolic precursors like cardanol and vanillin, for applications requiring specific thermal, mechanical, or electrical properties.

Additives that enhance a polymer's resistance to thermal degradation, high temperatures, or ignition, including flame retardants and heat stabilizers for improved safety and durability.

Multi-layer polymer films engineered to provide superior barrier properties against gases (e.g., oxygen), moisture, or aromas, often incorporating heat-sealing or resealing mechanisms for food and product preservation.

Polymer compositions designed to change their properties (e.g., shape, optical transmittance, solubility) in response to external stimuli such as pH, temperature, light, or chemical presence, enabling applications in sensors, smart windows, or controlled release.

Layered glass or film structures designed to optimize optical (e.g., light transmission, reflection, diffusion) and/or thermal (e.g., insulation, heat reflection/absorption) performance in windows, displays, and lighting applications.

Chemical additives or surface treatment methods aimed at improving the bonding strength of adhesives to various substrates, including those with challenging surface chemistries or contaminants.

Polymers incorporating reversible bonds or crosslinks that enable reprocessing, self-healing, or tunable mechanical properties, often responding to stimuli like heat, light, or pH for de-crosslinking and re-crosslinking.