Company patents
Richtek Technology Corporation
Richtek Technology Corporation's patent strategy is heavily concentrated in Power Conversion (DC/AC, DC/DC), accounting for 61.1% of its portfolio, which saw significant growth of +59.5% in 2024 and +32.2% in 2025, indicating a sustained focus. While many semiconductor-related categories show a decline in patenting so far in 2026, the emergence of Semiconductor Diodes & Transistors with 15 patents in 2025, up from zero in prior years, suggests a new area of interest despite the partial data for 2026 showing a decrease.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
337 US filings (since 2023) · 12 categories · 35 themes
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Methods and circuits to detect and compensate for various imperfections in amplifier operation, such as DC offset, gain errors, phase errors, duty-cycle errors, or input error components, to improve accuracy and signal integrity.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Design and control of power supply architectures that combine multiple power sources (e.g., AC grid, DC battery, generators) or modular battery units, often featuring switching, conversion, and redundancy for enhanced reliability and flexibility.
Circuit designs and control techniques focused on maximizing the power conversion efficiency of amplifiers, especially for radio frequency (RF) or audio applications, often involving load modulation, envelope tracking, or specific amplifier classes (e.g., Class-D, Doherty).
Systems and methods for transferring electrical energy without physical contact, often utilizing inductive or resonant coupling, including antenna design, resonance tracking, and control mechanisms for efficient power delivery.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Development and manufacturing of semiconductor devices using wide bandgap materials like Silicon Carbide (SiC) or Gallium Nitride (GaN) for high-power, high-frequency, or high-temperature applications.
Amplifier designs that allow for dynamic adjustment of their operating characteristics, such as gain, impedance, or amplification path, based on control signals, input conditions, or desired performance modes.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.
Technologies for efficiently delivering power to electric vehicles, encompassing fast charging, wireless charging, and smart grid integration, alongside vehicle-side control and management of the charging process.
Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.
Specialized amplifier types designed for converting current to voltage (transimpedance) or voltage to current (transconductance), often featuring virtual ground configurations, precise gain setting, and compensation for input/output characteristics.
Methods and systems for identifying anomalies, failures, or impending issues within electric motors or their associated drive and power management circuits, often by monitoring electrical or operational parameters.
Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.
Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Focuses on the design and manufacturing of transistors where the gate material fully encircles the channel, often using nanosheets or fins, to improve electrostatic control and reduce short-channel effects.
Integration of power converters with energy storage devices (batteries, supercapacitors) or grid interfaces, often involving AC/DC conversion, power flow management, and fault handling for hybrid power systems or specific applications like EVs or PV.
Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.
Circuitry and techniques specifically designed to amplify weak signals while minimizing the introduction of additional noise and maintaining high linearity, often incorporating impedance matching, parasitic neutralization, or protection circuits.
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Incorporation of novel semiconductor, dielectric, or metallic materials into transistor structures to achieve enhanced performance, new functionalities, or specific device characteristics.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Techniques for forming electrical contacts, vias, and interconnects to semiconductor devices, including advanced methods like contact-over-active-gate (COAG) and backside contacts for improved density and performance.
Integration of various sensor types (e.g., thermal, strain) or display components directly onto semiconductor substrates or within device architectures for compact and high-performance systems.
Digital logic circuits designed to interface with analog sensors or signals, including comparators, input buffers, differential input stages, and logic for processing sensor outputs (e.g., capacitance, optical, touch) for detection or measurement.
Patents
Showing 1-10 of 481