Company patents
Rockley Photonics Limited
Rockley Photonics Limited's patent strategy reveals a surprising and consistent decline across nearly all categories since 2023, with its core "Optical Elements & Systems" (49.7% of portfolio) showing a significant 25.0% YoY drop in 2025 and a further 61.1% decrease so far in 2026. This broad-based reduction, including a 100.0% YoY decline in "Photometry / Spectrometry" in 2025, suggests a substantial shift away from active patenting across its historical technology domains.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
159 US filings (since 2023) · 12 categories · 22 themes
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Innovations in the physical design, materials, fabrication, or packaging of photodetectors and optical sensor elements, including thermoelectric, NIR-compliant, and self-mixing interference types, to improve performance or integration.
Development of devices and methods for non-invasive or minimally invasive collection and analysis of physiological data, often from wearable sensors, to monitor health, activity, or specific conditions.
Methods and structures for assembling laser chips into functional modules, encompassing optical alignment, electrical interconnection, mechanical support, thermal management, and encapsulation for protection.
Design and integration of lasers and associated components specifically for transmitting data over optical fibers or through free space, including modulation schemes and efficient light coupling.
Techniques for manufacturing semiconductor laser chips, including active region design, mirror structures, current and optical confinement, and the integration of multiple layers or elements on a substrate.
Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.
Mechanisms and designs for actively changing or stabilizing the output wavelength, frequency, or spectral properties of a laser, often involving integrated optical filters, resonators, or pump adjustments.
Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Systems and components related to fiber lasers and fiber optical amplifiers, including doped fibers, pump schemes, and specialized fiber structures for gain, filtering, or thermal management.
Techniques and apparatus utilizing various spectroscopy methods (e.g., Raman, NIRS, photometric, interferometric) for identifying substances, measuring concentrations, or monitoring chemical and physical processes in industrial, environmental, or laboratory settings.
Methods and compositions for identifying, quantifying, or characterizing specific biological molecules (e.g., nucleic acids, proteins, metabolites, antibodies) or microbial species, often for diagnostic, prognostic, or quality control applications.
Systems and methods for acquiring and analyzing image data across multiple discrete spectral bands or a continuous spectrum, often for material characterization, environmental monitoring, or remote sensing applications.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.
Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.
Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Focuses on novel semiconductor materials, heterostructures, and doping profiles to improve photovoltaic conversion efficiency, stability, and spectral response.
Patents
Showing 1-10 of 288