Samsung Electro-Mechanics Co., Ltd.

Focuses on the internal and external structural elements, material compositions (e.g., ceramic dielectrics, electrode metals), and manufacturing techniques used to create multilayer ceramic capacitors (MLCCs), including aspects like mechanical robustness and internal circuitry.

Explores the composition and integration of solid or gel-based electrolyte materials within various capacitor types, such as solid electrolytic capacitors and supercapacitors, to enhance performance, stability, and safety.

Focuses on the physical design, materials, and methods for packaging capacitors and integrating them onto circuit boards, including external electrode structures, conductive adhesives, and mounting techniques to ensure reliable electrical and mechanical connections.

Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.

Ceramic materials and components engineered for specific functional applications, such as electronics, energy storage, wear resistance, or high-temperature heating elements.

Mechanisms and control systems for precise movement of optical lens elements, often for autofocus, zoom, or image stabilization, utilizing various driving principles (e.g., piezoelectric) and low-friction components.

Camera assemblies specifically designed for integration into vehicles, addressing challenges like mounting, field of view coverage, environmental robustness, and specialized imaging (e.g., near-infrared) for autonomous driving or safety.

Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Mechanical structures and devices designed to support, stabilize, or mount cameras and related photographic equipment, often featuring quick-release mechanisms, damping, or adjustable components.

Systems that combine data from multiple camera sensors or capture multiple images from different perspectives or qualities, often involving image processing techniques like synthesis to create enhanced or comprehensive views.

Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.

Process and equipment for producing solid-state battery cells, including solid electrolyte synthesis (sulfide/oxide/polymer), thin-film deposition, lamination, sintering, dry-electrode fabrication, and stacking under controlled atmosphere.

Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.

Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.

Methods and structures for encapsulating, interconnecting, and integrating impedance network components, particularly acoustic filters, into larger modules or systems.

Techniques and structures used to reduce unwanted electromagnetic coupling, scattering, or interference between multiple antennas, different frequency bands, or sensitive electronic components within a device.

Devices utilizing piezoelectric materials to generate and filter acoustic waves, often for radio frequency applications, including surface acoustic wave (SAW) and bulk acoustic wave (BAW) structures.

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

Development and processing of metal powders with specific magnetic properties, including soft magnetic alloys, permanent magnet materials, and insulated powders for electronic components, often involving precise control of particle size, morphology, and composition.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Describes capacitors designed with actively variable capacitance, often employing phase-change materials or mechanical actuation, for use in radio frequency (RF) components, reconfigurable intelligent surfaces, and other tunable electronic systems.

Involves the development of novel materials and porous structures for the electrodes of supercapacitors and other electrochemical energy storage devices, aiming for high charge density, improved performance, and flexibility.

Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Processes and apparatus for disassembling spent batteries and recovering valuable materials (e.g., metals, electrolytes, plastics) through mechanical, chemical, or electrochemical methods for reuse or sustainable disposal.

Slurry compositions and coating processes for battery electrodes, including binder/active-material slurries, surface coating layers, and electrode-to-foil adhesion for cathode and anode.

Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.

Active anode materials and manufacturing techniques for rechargeable lithium-ion batteries, including silicon-carbon composites, graphite, lithium-metal anodes, and electrode coating processes that improve capacity, cycle life, and rate capability.

Methods and processes for fabricating ceramic matrix composites (CMCs), including preform creation, infiltration techniques, and densification to form complex shapes with enhanced properties.

Systems and methods for electronically steering or shaping antenna beams by controlling the phase and amplitude of signals fed to individual elements in an array, including calibration techniques and multi-antenna configurations.

Circuits designed to transform the impedance of a source to match the impedance of a load, maximizing power transfer or minimizing signal reflections, often involving inductors, capacitors, and transformers.

The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.

Systems and components for projecting images, including light sources (e.g., laser), optical modulation elements (e.g., metasurfaces, spatial modulators), and optical paths for generating and displaying images.

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Systems and devices that utilize controlled magnetic fields, often generated by electromagnets, to produce mechanical motion, precise positioning, or manipulate physical phenomena like plasma distribution.

Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.

Focuses on the structural integrity, housing, mounting, and physical integration of battery cells into robust and protected packs within electric vehicles, including manufacturing considerations.

Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.