SEIKO INSTRUMENTS INC.

Provided is a voltage regulator including a leakage current correction circuit capable of keeping the accuracy of an output voltage of the voltage regulator even when an output voltage of a reference voltage circuit is decreased due to the influence of a leakage current. The voltage regulator includes: a reference voltage circuit configured to output a reference voltage; an output transistor configured to output an output voltage; a voltage divider circuit configured to divide the output voltage to output a feedback voltage; an error amplifier circuit configured to amplify a difference between the reference voltage and the feedback voltage, and output the amplified difference to control a gate of the output transistor; and a leakage current correction circuit connected to an output terminal of the voltage divider circuit. The leakage current correction circuit is configured to decrease the feedback voltage to prevent the output voltage from dropping at high temperature.

A pressure sensor includes a sensor body which has a first surface and a cavity with an opening in the first surface, a cantilever which has a base end portion supported on the first surface and a distal end portion provided to form a gap from a peripheral edge of the opening inside the opening, is flexurally deformed according to a pressure difference between an inside and an outside of the cavity, and is formed of a semiconductor material, and a displacement measurement unit which measures a displacement of the cantilever vibrating according to the pressure difference at a frequency larger than a lower limit frequency f LOW (Hz) defined by Expression (1), where a width (μm) of the gap is represented by G, a volume (ml) of the cavity is represented by V, and a proportional constant is represented by k. f LOW =k ·( G 2 /V )  (1)

Provided is a constant current circuit in which an enhancement N-channel transistor can operate in a weak-inversion state even at high temperatures. A constant current circuit includes a current mirror circuit, a constant-current generation block circuit, and an off-leak circuit, wherein the off-leak circuit is constituted by a first enhancement N-channel transistor having a gate and a source connected to an earth terminal and a drain connected to an output of the constant current circuit. This suppresses an increase in a gate-to-source voltage of the enhancement N-channel transistor which generates a constant current, thereby maintaining its operation in a weak-inversion state.

Provided are a cell balance device for protecting a switch circuit from an overcurrent flow. The cell balance device includes: a plurality of electric accumulator connection terminals each connected to one of a node and two terminals of electric accumulators connected in series; a voltage hold device connection terminal connected to a voltage hold device; a plurality of first switch circuits provided between the plurality of electric accumulator connection terminals and the voltage hold device; a control circuit for controlling ON/OFF of the plurality of first switch circuits based on a synchronization signal; and an overcurrent detection circuit for detecting an overcurrent flowing through each of the plurality of first switch circuits.

A thermal head including: a laminated substrate including a support substrate and an upper substrate at least one of which has a recess formed in a surface thereof; a heat generating resistor formed on a surface of the upper substrate in the laminated substrate at a position opposed to the recess; and a pair of electrode portions connected to each of both ends of a heat generating resistor, wherein the laminated substrate further includes: an intermediate metal layer sandwiched between the support substrate and the upper substrate and bonded thereto in a laminated state; and a surrounding metal layer formed of a metal material, the surrounding metal layer provided in contact with the intermediate metal layer and formed from a surface of the support substrate extending in a thickness direction thereof to a surface thereof opposite to a portion bonded to the upper substrate.

A power feeding system ( 100 ) includes a power feeding device ( 1 ) and a power receiving device ( 2 ). The power feeding device ( 1 ) includes: a drive transistor ( 13 ) connected to a feeding coil ( 11 ); a drive signal generation section ( 30 ) configured to generate a drive signal for driving the feeding coil ( 11 ); a crest value variation detection section ( 40 ) configured to detect the change in the resonant state of the resonant circuit ( 20 ) as a periodic waveform variation in a voltage excited in the feeding coil ( 11 ); and a drive control section ( 50 ) configured to determine whether or not electric power is suppliable to the power receiving device ( 2 ) based on the periodic waveform variation, and control to whether or not to continuously supply the drive signal to the drive transistor ( 13 ) based on a result of the determination.

Provided is a semiconductor device capable of being firmly bonded to a substrate. An outer lead ( 11 ) exposed from an encapsulating resin ( 5 ) of a flat lead package includes: a distal end in which a through recessed portion ( 2 x ) covered with a thick plated layer is formed; and a bottom surface on which an inclined portion ( 6 ) covered with a thick plated layer is formed. The cutting area of the distal end of the outer lead is accordingly reduced.

A resin-encapsulated semiconductor device includes: a semiconductor element mounted on a die pad portion; a plurality of lead portions disposed so that distal end parts thereof are opposed to the die pad portion; a metal thin wire for connecting an electrode of the semiconductor element to the lead portion; and an encapsulating resin for partially encapsulating those components. A bottom surface part of the die pad portion, and a bottom surface part, an outer surface part, and an upper end part of the lead portion are exposed from the encapsulating resin. A plated layer is formed on the exposed lead bottom surface part and the exposed lead upper end part.

A lower mold ( 2 ) of a set of upper and lower molds for resin encapsulation of a lead frame having a semiconductor chip mounted thereon is provided with a tapered positioning pin ( 3 ) to be engaged with a positioning hole formed in the lead frame. A columnar portion of the tapered positioning pin has an outer diameter larger than an inner diameter of a positioning hole. An ejector pin ( 4 ) and an ejector pin in a pair ( 5 ) for ejecting a package out of the molds after the molding are fixed town ejector pin coupling mechanism ( 6 ).

Provision of a timepiece capable of maintaining the reliability in holding a state where a bezel is mounted to a shell, preventing the wobble of the bezel as well as regulating a rotation operation torque without using a dedicated packing material. A timepiece 11 includes a case 12 having a shell 21 , a ring-shaped bezel 41 and a ring-shaped mounting member 51 . An engaging projection 33 extending in a circumferential direction is formed at an outer periphery of an annular convex portion 31 included in the shell 21 . The bezel 41 has an inner peripheral concave portion 44 surrounding the outer periphery of the annular convex portion 31 . The mounting member 51 includes an outer peripheral portion 52 arranged in the inner peripheral concave portion 44 , an inner peripheral portion 54 continued from the outer peripheral portion 52 and an engaging portion 56 formed in the inner peripheral portion 54 . The inner peripheral portion 54 can be elastically deformed in directions close to and away from the outer peripheral portion 52 by an annular groove 59 formed between the inner peripheral portion 54 and the outer peripheral portion 52 . The engaging portion 56 can be engaged with and disengaged from the engaging projection 33 with the elastic deformation of the inner peripheral portion 54 . An engaged state between the engaging projection 33 and the engaging portion 56 is maintained by the elastic force of the inner peripheral portion 54 in a state where the bezel 41 is arranged so as to be rotatively operated while covering the outer periphery of the annular convex portion 31.