Company patents
SEKISUI KASEI CO., LTD.
SEKISUI KASEI CO., LTD. demonstrates a strong, albeit fluctuating, focus on core materials science, with Polymer Working & Compounding (47.4% of portfolio), Polymer Compositions (36.8%), and Polymer Synthesis (Polymerization) (34.2%) dominating its patent activity. While these core areas saw significant growth in 2024 (e.g., Polymer Working & Compounding at +700.0% YoY), their subsequent decline in 2025 and so far in 2026 suggests a shifting priority, with emerging interests in areas like Sterilization & Biocompatible Materials, which saw a surge of 3 patents in 2025 after no activity in prior years.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
38 US filings (since 2023) · 12 categories · 15 themes
Polymer compositions incorporating inorganic or organic filler materials to impart specific functional properties such as thermal conductivity, flame retardancy, electrical conductivity, or enhanced mechanical strength and dimensional stability.
Methods for creating fine polymer particles, powders, or microspheres with controlled size, morphology, and distribution, used as raw materials or for specific applications.
Polymer compositions engineered for enhanced heat resistance, thermal stability in molten states, or improved processability at high temperatures, often involving specific copolymers, blends, or stabilizing additives for applications in electronics or automotive.
Synthesis and application of crosslinked polymer networks designed to swell in water, often for medical, sensing, or smart material applications, exhibiting properties like hydrolysis resistance, thermochromism, or radiation protection.
Development and application of polymer compositions designed for reprocessability, recyclability, or incorporating sustainable additives, often featuring reversible bonds or bio-based components.
Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.
Polymer compositions tailored for medical and biological applications, including implantable devices, drug delivery systems, and diagnostic tools, emphasizing properties like biocompatibility, hydrolysis resistance, optical clarity, and specific mechanical characteristics.
Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.
Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.
Materials and structures designed for implantation or tissue regeneration, focusing on properties like biodegradability, mechanical strength, cellular integration, and long-term in-vivo stability.
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
Novel methods and reactor designs for polymer synthesis, focusing on improving efficiency, achieving continuous production, or controlling specific polymer architectures and product morphologies like particle size or sheet formation.
Techniques for manufacturing thin polymer layers, sheets, or multi-layer structures, often optimized for specific properties such as flexibility, barrier function, filtration, or mechanical strength.
Additives that enhance a polymer's resistance to thermal degradation, high temperatures, or ignition, including flame retardants and heat stabilizers for improved safety and durability.
Materials added to polymers to modify their thermal transfer properties, typically increasing conductivity for heat dissipation in applications like electronics or battery packs.
Patents
Showing 1-10 of 18
Polymer Particle and Powder Production