SEMES CO., LTD.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.

Specialized cleaning techniques and apparatus designed for removing microscopic contaminants, residues, or films from sensitive substrates, such as semiconductor wafers or flat panel displays, often involving chemical, mechanical, or plasma-based methods.

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.

Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.

Mechanisms and methods for preventing or removing clogs, ink residue, or contaminants from printhead nozzles and surfaces to ensure consistent print quality and extend printhead lifespan.

Systems and components for storing, delivering, circulating, and managing printing liquids (e.g., ink) to the printhead, often including features for pressure regulation, filtration, degassing, and balancing liquid levels.

Systems and processes for applying coatings, films, or materials onto surfaces in manufacturing or industrial contexts, often involving automated movement, surface preparation, or post-application treatment.

Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.

Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.

Technologies for precisely controlling the timing and volume of liquid droplet ejection, and for real-time or post-ejection monitoring of droplet trajectory, velocity, and nozzle health to maintain print accuracy and quality.

Systems specifically engineered to use sprayed liquids or aerosols for cleaning surfaces, removing residues, or distributing disinfectants in various environments.

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.

Techniques and apparatus for measuring critical dimensions, overlay accuracy, defect detection, and surface topography in lithographic processes, often involving optical, laser, or charged particle beams.

Innovations in the design and arrangement of piezoelectric or thermal actuators, drive electronics, and fluidic structures within the printhead to achieve precise and efficient liquid ejection.

Systems and methods for efficient storage, retrieval, and sorting of items within warehouses, distribution centers, or manufacturing facilities, often involving vertical lifts, high-throughput sorters, or inventory management logic.

Systems and mechanisms designed to safely and efficiently interface transport vehicles (trucks, trailers) with loading docks or automated loading systems, including vehicle restraint, telescopic loading arms, and specialized vehicle-mounted conveyors.

Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.

Techniques and systems for real-time or near-real-time measurement and adjustment of semiconductor manufacturing parameters (e.g., temperature, etch rate, ion beam uniformity) to ensure process quality and consistency.

Focuses on the mechanisms, control, and sensing involved in robots or automated systems accurately grasping, moving, and releasing individual items, often in conjunction with conveyor systems or storage units, including path planning and end effector design.

Design aspects of user-replaceable cartridges or containers for printing consumables (e.g., ink, tape, labels) that facilitate easy installation, proper positioning, type identification, and reliable supply to the printer.

Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.

Methods and systems for monitoring the operational status, detecting anomalies, ensuring safe interaction, and preventing damage or injury in robotic systems.

Systems and methods for accurately controlling the volume, location, and characteristics of sprayed fluids, often involving sensors, feedback, or specific nozzle geometries for precise application.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Mechanisms for storing, dispensing, and monitoring the delivery of liquid or solid laundry additives (detergents, softeners) into the wash fluid, including diagnostics for ensuring correct operation.

Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.

Development of novel chemical compositions for photoresists, including polymers, sensitizers, and crosslinking agents, to achieve improved lithographic performance such as resolution, sensitivity, line edge roughness, and etch resistance.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Integration of sensors, data processing, and control systems to assess the effectiveness of a cleaning process, detect contaminants, measure cleaning agent delivery, and optimize operational parameters for efficiency and thoroughness.

Technologies for removing contaminants from critical surfaces of sensors, vehicle parts, or industrial components, often involving automated or semi-automated processes. This can include physical, acoustic, or fluid-based methods to maintain functionality.

Spraying devices designed to handle, mix, or independently dispense multiple distinct fluid components, often with mechanisms for selection, blending, or sequential application.

Mechanisms and sensors for accurately conveying, positioning, loading, and managing various types of recording media (e.g., paper, fabric, labels) through a printing apparatus, and detecting their presence, type, or potential collision.

Processes involving chemical and mechanical forces to planarize surfaces (CMP) or wet chemical treatments for cleaning, etching, or material removal, often utilizing specialized compositions, nozzles, or fluid management systems.

Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.

Utilizing sensor data, historical performance, and analytical models to anticipate equipment failures, diagnose faults, and estimate remaining useful life, thereby enabling proactive maintenance and reducing downtime.

Techniques and apparatus for achieving and maintaining vacuum conditions within charged particle and plasma processing chambers, including pump control, vacuum degree monitoring, and chamber sealing.

Utilizing machine learning, particularly deep learning, to analyze medical data such as images, sensor readings, or physiological signals for disease prediction, diagnosis, or treatment assessment.

Techniques utilizing deep learning models like Generative Adversarial Networks (GANs) or diffusion models to create new images, modify existing ones, or generate synthetic data based on various inputs or conditions.

Innovations in the physical structure, materials, support mechanisms, and operational monitoring of conveyor belts to improve durability, cleanliness, safety, or specific handling capabilities, including specialized drive mechanisms.

Design and control of advanced robotic grippers, tools, and mechanical linkages for specific manipulation tasks or operating in challenging environments.

Innovations in nozzle internal geometry, actuation, or multi-fluid mixing to achieve specific spray patterns, droplet sizes, or performance characteristics, especially for challenging fluids or conditions.