Company patents
SEMTECH CORPORATION
Semtech Corporation's patent strategy reveals a surprising shift away from core semiconductor manufacturing processes, with Semiconductor Manufacturing Process and Semiconductor Packaging & Encapsulation both seeing a 100.0% decline in patenting so far in 2026. While Amplifiers and Pulse / Digital Logic Circuits remain significant at 16.7% each, their patenting activity has also slowed considerably from 2024 peaks, suggesting a potential re-evaluation of investment in these areas despite their historical importance.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
84 US filings (since 2023) · 12 categories · 20 themes
Specialized amplifier types designed for converting current to voltage (transimpedance) or voltage to current (transconductance), often featuring virtual ground configurations, precise gain setting, and compensation for input/output characteristics.
Design and implementation of capacitive sensors, including methods for improving accuracy, reducing power consumption, compensating for environmental variations (like temperature), and analyzing complex displacement interactions.
Circuit designs and control techniques focused on maximizing the power conversion efficiency of amplifiers, especially for radio frequency (RF) or audio applications, often involving load modulation, envelope tracking, or specific amplifier classes (e.g., Class-D, Doherty).
Amplifier designs that allow for dynamic adjustment of their operating characteristics, such as gain, impedance, or amplification path, based on control signals, input conditions, or desired performance modes.
Techniques and hardware architectures for optimizing the radio frequency (RF) front-end, antenna systems, and beamforming strategies in wireless networks to improve signal quality, capacity, and interference mitigation.
Techniques and circuits for accurately identifying various electrical faults, such as ground faults, overcurrent, short circuits, switch malfunctions, or electrostatic discharge (ESD) events, often utilizing sensors, signal processing, and diagnostic algorithms.
Methods and systems for accurately determining the absolute or relative position of an object or device, often integrating satellite navigation (GNSS), inertial measurement units (IMU), and local ranging or wireless communication technologies.
Methods and circuits to detect and compensate for various imperfections in amplifier operation, such as DC offset, gain errors, phase errors, duty-cycle errors, or input error components, to improve accuracy and signal integrity.
Design and configuration of adaptable frame structures, resource block groupings, and subcarrier spacings to optimize data transmission across diverse wireless environments and services, including considerations for fronthaul interfaces.
Specialized circuits and devices designed to protect electrical and electronic systems from transient overvoltages caused by electrostatic discharge (ESD) or power surges, often involving suppressor diodes, gas discharge tubes (GDTs), or voltage clamping mechanisms.
Methods for designing, transmitting, and utilizing specific reference signals (e.g., DMRS, SRS, PT-RS) to enable accurate channel estimation, interference measurement, synchronization, or sensing in wireless communication systems.
Integration of optical sensors, particularly for biometrics or other surface interactions, beneath a display or protective cover, requiring specialized optical paths, illumination, and packaging.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Methods and devices that determine the position, angle, or distance of an object by detecting changes in magnetic fields or inductive coupling.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Techniques enabling simultaneous transmission and reception of signals on the same or adjacent frequency bands, including methods for managing and mitigating self-interference and configuring network resources for such operation.
Systems and methods designed to improve the accuracy, reliability, or operational range of sensors and electronic components by measuring temperature and applying corrections or adjustments.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Intelligent control systems that manage the connection and disconnection of power, including pre-charging capacitive loads, reclosing after faults, or isolating parts of a grid based on detected conditions, often involving smart switches and relays with adaptive logic.
Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.
Patents
Showing 1-10 of 142