Company patents
SiTime Corporation
SiTime Corporation's patent strategy is heavily concentrated in Impedance Networks (Filters, Resonators), accounting for 50.6% of its portfolio, which saw a significant 30.0% YoY growth in 2025, suggesting a continued focus, despite a sharp decline so far in 2026. Surprisingly, while core semiconductor areas like Inorganic Devices and Semiconductor Packaging & Encapsulation show some growth in 2025, there's a notable shift away from manufacturing-related categories such as Force / Pressure Measurement and Temperature Measurement, with no new patents so far in 2026 for the former and a 100.0% decline in 2025 for the latter.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
77 US filings (since 2023) · 10 categories · 15 themes
Focuses on the design, fabrication, and application of piezoelectric materials and devices for sensing, actuation, or wave generation, including material properties, single crystal growth, and protective layers.
Devices utilizing piezoelectric materials to generate and filter acoustic waves, often for radio frequency applications, including surface acoustic wave (SAW) and bulk acoustic wave (BAW) structures.
Measures force or pressure by detecting changes in electrical capacitance. This typically involves the deformation of a dielectric material or the relative movement of conductive plates, altering the distance or area between them.
Methods and devices for integrating temperature sensors directly into materials, structures, or challenging environments (e.g., hydrogen tanks, concrete, ocean) to measure internal or localized temperatures.
Techniques for measuring, monitoring, and compensating for temperature variations within semiconductor devices, integrated circuits, or photonic components to maintain performance, prevent degradation, and ensure reliability across operating conditions.
Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.
Temperature sensing systems integrated into wearable devices or medical apparatus for monitoring physiological conditions, such as inflammation detection, often utilizing differential temperature measurements.
Methods and structures for encapsulating, interconnecting, and integrating impedance network components, particularly acoustic filters, into larger modules or systems.
Sensors and systems designed to detect and quantify localized contact forces, pressure distribution, or touch interactions, often employed in robotics, human-machine interfaces, or object manipulation applications.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
The integration of force, strain, or temperature sensors directly into large-scale structures or components (e.g., concrete, pavement, pipelines) to enable real-time health assessment, anomaly detection, and long-term performance monitoring.
Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Patents
Showing 1-9 of 9
Embedded & Structural Temperature Sensing