Company patents
STMicroelectronics France
STMicroelectronics France's patent strategy reveals a surprising shift away from several core semiconductor areas, with categories like Semiconductor Manufacturing Process, Semiconductor Packaging & Encapsulation, Multi-Chip & 3D Assemblies, and Integrated Circuit Layout & Arrangement all experiencing significant declines (YoY -100.0%) in 2025 or 2026 so far. While Semiconductor Diodes & Transistors remains their largest category at 19.5% of the portfolio, its -33.3% YoY decline in 2026, alongside a -100.0% YoY decline in Pictorial / Video Communications, suggests a re-evaluation of established priorities, despite a strong 200.0% YoY growth in Machine Learning & AI in 2025.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
77 US filings (since 2023) · 12 categories · 20 themes
Design and operation of transistors optimized for memory applications, including floating body devices, ferroelectric FETs (FeFETs), vertical TFTs for 3D arrays, and charge-trapping memory cells.
Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.
Focuses on the design and manufacturing of transistors where the gate material fully encircles the channel, often using nanosheets or fins, to improve electrostatic control and reduce short-channel effects.
Focuses on the physical construction and integration of electronic components, such as antennas, IC chips, and display elements, into smart cards or secure documents, often involving multi-layer structures and specialized materials.
Design and implementation of non-traditional logic gates or memory elements, often leveraging new materials or device physics to achieve multi-functionality, adaptive thresholds, or higher density.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Layout, material composition, and structural arrangement of photoelectric conversion elements and associated circuitry within image sensor arrays, including infrared detectors and back-side illuminated structures.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Systems and methods for uniquely identifying, tracking, and managing physical items using scannable codes (barcodes, QR codes) or wireless tags (RFID, IoT devices) to link physical objects to digital information, inventory, or services.
Techniques for combining data from disparate sensor types (e.g., cameras, radar, mobile device signals) to achieve a more robust and comprehensive understanding of an environment or subject, often leveraging machine learning for interpretation and correlation.
Digital logic circuits designed to interface with analog sensors or signals, including comparators, input buffers, differential input stages, and logic for processing sensor outputs (e.g., capacitance, optical, touch) for detection or measurement.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Techniques used by sensing systems to identify the presence, location, and characteristics of objects or unusual conditions in an environment, including methods to suppress false positives or 'ghost' detections.
Specialized digital and mixed-signal circuits for controlling and reading out quantum bits (qubits), including generating precise modulated RF signals and integrating with photonic components for quantum operations.
Methods and apparatus for improving the visual fidelity, resolution, or compression efficiency of video signals, often through advanced processing, up-scaling, or neural network-based filters.
Systems that combine data from multiple camera sensors or capture multiple images from different perspectives or qualities, often involving image processing techniques like synthesis to create enhanced or comprehensive views.
Specialized hardware, architectural designs, and computational methods to improve the speed, efficiency, and security of artificial intelligence and machine learning model execution, particularly for inference and data processing.
Patents
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Multi-Sensor Imaging & Synthesis