Company patents
STMICROELECTRONICS, INC.
STMicroelectronics, Inc. appears to be significantly shifting its patent strategy away from core semiconductor manufacturing, with categories like Semiconductor Manufacturing Process (32.8% of portfolio) and Semiconductor Packaging & Encapsulation (31.3% of portfolio) showing consistent declines of 0.0% and -23.1% respectively in 2025, and sharp drops so far in 2026. Surprisingly, amidst these declines, the company is showing an emerging focus in Radar / Sonar / Lidar, which saw a 66.7% year-over-year growth in 2026 (so far), suggesting a strategic pivot towards advanced sensing technologies.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
134 US filings (since 2023) · 12 categories · 21 themes
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.
Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Integration and processing of data from diverse sensors (e.g., magnetometers, odometers, IMUs, vision sensors) to achieve robust and accurate positioning, especially in environments where GPS is unreliable or unavailable.
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Methods and systems for accurately determining the absolute or relative position of an object or device, often integrating satellite navigation (GNSS), inertial measurement units (IMU), and local ranging or wireless communication technologies.
Design and operation of transistors optimized for memory applications, including floating body devices, ferroelectric FETs (FeFETs), vertical TFTs for 3D arrays, and charge-trapping memory cells.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Techniques for combining data from disparate sensor types (e.g., cameras, radar, mobile device signals) to achieve a more robust and comprehensive understanding of an environment or subject, often leveraging machine learning for interpretation and correlation.
Incorporation of novel semiconductor, dielectric, or metallic materials into transistor structures to achieve enhanced performance, new functionalities, or specific device characteristics.
Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.
Designing user interfaces and interaction methods specifically for mobile or wearable devices, enabling control of external systems, monitoring user states, or facilitating real-world transactions.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Techniques used by sensing systems to identify the presence, location, and characteristics of objects or unusual conditions in an environment, including methods to suppress false positives or 'ghost' detections.
Innovations in the physical components and architectures of radar, lidar, and sonar systems, including antenna design, RF signal generation, beam steering mechanisms, and optical elements for improved performance.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Systems that monitor a vehicle operator's physiological state, attentiveness, or behavior using in-cabin sensors and machine learning to enhance safety or personalize vehicle functions.
Patents
Showing 1-10 of 279