SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

A coil device includes at least one printed wiring board. Each of the at least one printed wiring board has a first base film having a first main surface and a second main surface opposite to the first main surface, and a first wire disposed on the first main surface. The first wire has a plurality of first coil portions arranged along a first direction in a plan view. Each of the plurality of first coil portions is constituted by the first wire wound spirally in a plan view, and has a first straight portion and a second straight portion, and a first connection portion and a second connection portion. In a plan view, the first wire at the first straight portion and the first wire at the second straight portion extend along a second direction orthogonal to the first direction.

A flexible printed circuit board includes: an electrically insulating layer having a first surface and a second surface opposite to the first surface; a first wiring disposed on the first surface; a second wiring disposed on the second surface; and an electrically conductive layer. The first wiring includes a first land. The second wiring includes a second land. The first wiring includes a first layer disposed on the first surface and a second layer disposed on the first layer. The second wiring includes a third layer disposed on the second surface and a fourth layer disposed on the third layer. The first land and the second land overlap each other in a plan view. The electrically insulating layer is provided with a through hole extending through the electrically insulating layer in a thickness direction and overlapping the first land and the second land at least partially in the plan view.

A flexible printed circuit board includes an electrically conductive line, and a land connected to the electrically conductive line and to be connected to a terminal, the land including soldering portions that have metal surfaces and to which the terminal is to be soldered. The terminal includes an overlapping section that overlaps the flexible printed circuit board and a protruding section that protrudes outward from the flexible printed circuit board and is soldered to a connecting member that connects electrode portions of power storage elements.

A coil device includes a first printed wiring board and a second printed wiring board. The first printed wiring board include a first base film having a first main surface, and a first wire disposed on the first main surface. The first wire includes a plurality of first coil portions each formed by winding the first wire spirally in a plan view, the plurality of first coil portions being arranged along a circumferential direction. The second printed wiring board includes a second base film having a second main surface and a third main surface, and a second wire disposed on the second main surface. The third main surface faces the first main surface. The second wire includes a plurality of second coil portions each formed by winding the second wire spirally in plan view, the plurality of second coil portions being arranged along the circumferential direction.

A printed wiring board includes an insulating layer having a first main surface and a second main surface, a first copper layer disposed on the first main surface, a second copper layer disposed on the second main surface; and a third copper layer. A through-hole reaching the second copper layer is formed in the insulating layer and the first copper layer, the third copper layer is disposed on the second copper layer inside the through-hole, on an inner wall surface of the through-hole, and on the first copper layer located around the through-hole, a single copper layer is disposed on the inner wall surface of the through-hole, and the single copper layer is the third copper layer.

A flexible printed circuit board according to an embodiment includes a base film and a first wire. The base film has a first surface. The first wire is disposed on the first surface. The first wire has a first layer and a second layer. The first layer is disposed on the first surface directly or indirectly. The second layer covers the first layer. In the first surface, a first groove is formed next to the first layer in a plan view. The second layer on a side surface of the first layer exists on a bottom surface and a side surface of the first groove.

A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer and a second conductor layer.

A circuit board includes a fluororesin layer, an adherend layer and an adhesion layer bonding the fluororesin layer and the adherend layer together, the fluororesin layer contains polytetrafluoroethylene and a first inorganic filler, a content of the first inorganic filler in the fluororesin layer is 50% by volume to 66% by volume, the adhesion layer contains a resin and a second inorganic filler, a content of a fluororesin in the resin is 5% by mass or less, a content of the second inorganic filler in the adhesion layer is 29% by volume to 47% by volume, and a through-hole extending through the fluororesin layer and the adhesion layer is formed.

A printed circuit board includes a bendable portion. The bendable portion is bendable in a bending direction in plan view and has a first dielectric layer, a signal pattern, a second dielectric layer, a cloth, and a ground pattern. The first dielectric layer has a first main surface. The signal pattern is arranged on the first main surface. The second dielectric layer has a second main surface and a third main surface opposite to the second main surface, and the second main surface is arranged to face the first main surface. The cloth includes a plurality of first reinforced fibers extending in a first direction in plan view and a plurality of second reinforced fibers extending in a second direction inclined with respect to the first direction in plan view, the plurality of first reinforced fibers and the plurality of second reinforced fibers being knitted together in a cloth form.

A printed circuit board includes a first dielectric layer, a signal pattern, a first contact portion, a second dielectric layer, and a first ground pattern. The first dielectric layer has a first surface and a second surface. The signal pattern is arranged on the second surface and extends in a first direction. The first contact portion is arranged on the second surface and connected to one end of the signal pattern. The second dielectric layer is arranged on the second surface to cover the signal pattern and expose the first contact portion. The first ground pattern is arranged on the second dielectric layer. The second dielectric layer has an adhesion layer and a resin layer including a cloth in which a reinforced fiber is woven. The resin layer has a first side surface adjacent to the first contact portion in the first direction.