Super Micro Computer, Inc.

This application is directed to an electronic system that uses multiple power supply signals. The electronic system includes a first power interface for receiving a first power supply signal, a second power interface for receiving a second power supply signal, a power converter, and a controller. The power converter is configured to generate a plurality of DC power supplies based on at least one of the first power supply signal and the second power supply signal. The controller is configured to control the first power interface and the second power interface and select the at least one of the first power supply signal and the second power supply signal to generate the plurality of DC power supplies. Each of the first and second power interfaces may have a power switch and be controlled to provide a respective power supply signal to the power converter.

This application is directed to heat dissipation for interconnect transceivers applied in a server system. A server rack includes a rack structure for supporting one or more rack servers and a switch box mechanically mounted on the rack structure. The switch box is configured to receive detachable optical interconnects, and includes a transceiver module and a cooling structure coupled to the transceiver module. The transceiver module is configured to convert incoming signals to outgoing signals and generate heat while converting the incoming signals. The cooling structure is configured to inject a coolant via an inlet and output the coolant via an outlet, thereby allowing the coolant to at least partially carry away the heat generated by the transceiver module. In some embodiments, the cooling structure includes a metallic plate, which comes into contact with the transceiver module via a contact surface for absorbing the heat generated by the transceiver module.

Disclosed is a heat sink assembly for dual in-line memory modules (DIMMs). The heat sink assembly includes side plates and a heat sink of an electronic device. The side plates clamp the DIMMs. Heat from the DIMMs is conducted to the heat sink of the electronic device, which is cooled by a liquid coolant.

A data center has a management system for selecting a server computer to start or shut down. The management system has a machine learning model that is trained to predict power consumption of the data center using a large training dataset of many, different data centers. The machine learning model is fine-tuned using data of server computers of the data center. Input data that include temperature information of a server computer and position of the server computer are input to the machine learning model to obtain a predicted difference in power consumption of the data center. Predicted differences in power consumption of the data center are compared to select a server computer to start or shut down.

An immersion cooling system includes a tank that contains a dielectric coolant. A main pump circulates the dielectric coolant through the tank and a heat exchanger. Electronic devices are submerged in the dielectric coolant in the tank. An electronic device includes a substrate, an electronic component that is mounted on the substrate, a heat sink that is attached to the electronic component, and a forced convection device that directs the dielectric coolant from within a housing of the electronic device toward the heat sink.

A computing device has several smart network interface cards (NICs) with RJ45 connectors. The smart NICs are in master-slave arrangement, where internal RJ45 connectors of the master smart NIC are connected by RJ45 cables to respective RJ45 connectors of slave smart NICs. A front RJ45 connector of the master smart NIC is connected by an RJ45 cable to a network switch that is installed in a same rack as the computing device.

A precooling device integrated with a cooling distribution unit and a server liquid cooling system are provided. The precooling device includes a liquid cooling row, an adapter assembly, and a cooling distribution unit. The adapter assembly includes a flow joining row and a flow distribution row. The cooling distribution unit supplies a refrigerant from an interior thereof, and includes an outlet and an inlet communicating with the interior. The outlet communicates with the flow distribution row of the adapter assembly to deliver the refrigerant for heat exchange. The refrigerant being performed the heat exchange returns to the liquid cooling row through the flow joining row of the adapter assembly for precooling, and then returns from the liquid cooling row to the cooling distribution unit through the inlet. The refrigerant is precooled before returning to the cooling distribution unit.

A cooling device for rack servers and cooling method for rack servers are provided. The cooling device for rack servers includes an environmental temperature sensor, a humidity sensor, a coolant temperature sensor, an electronic valve, and a controller. The controller is configured to compute a dew point temperature according to an ambient temperature and an ambient humidity sensed by the environmental temperature sensor and the humidity sensor, compute a temperature difference between a outlet-liquid temperature of a coolant and the dew point temperature, and control an opening of the electronic valve according to the temperature difference to adjust a liquid flow of the coolant outputted, such that the outlet-liquid temperature dynamically changes following the adjustment of the liquid flow.

A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

Disclosed is an electronic assembly with an integrated spiral inductor. The electronic assembly includes a substrate that has through holes, which are disposed along a side edge of the substrate. A wire of the spiral inductor is wound several turns, in spiral fashion, around the side edge by way of the through holes. A magnetic core can be included in the spiral inductor for increased inductance. The electronic assembly can have an additional substrate, and the spiral inductor spirals around side edges of the substrates by way of through holes of the substrates.