Company patents

Super Micro Computer, Inc.

Super Micro Computer, Inc. surprisingly shows a highly concentrated patent strategy, with 71.4% of its portfolio in Printed Circuits & Electronic Assemblies, a category that saw a -10.0% decline so far in 2026. Despite this core focus, an emerging priority is evident in Hardware Platform (Cooling, Power, Packaging), which experienced a significant +300.0% growth in 2026, indicating a strategic shift towards foundational computing infrastructure.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

49 US filings (since 2023) · 12 categories · 12 themes

Advanced Electronic Packaging

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
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7since 2023
+200.0%YoY
Flexible and Printed Circuitry

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Printed Circuits & Electronic Assemblies
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4since 2023
-50.0%YoY
Leak and Seal Integrity Testing

Methods and systems for detecting fluid or gas leaks, or assessing the quality and continuity of seals in containers, systems, or structures. This often involves pressure changes, electrical properties, or acoustic analysis.

Machine Testing
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3since 2023
new
Secure Data Storage & Provenance

Techniques for protecting data at rest or in backup, ensuring its integrity, confidentiality, and verifiable origin, often involving encryption, unique identifiers, or secure repositories.

Computer Security
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3since 2023
+100.0%YoY
Device Enclosure & Material Engineering

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Printed Circuits & Electronic Assemblies
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3since 2023
new
High-Density Magnetic Component Integration

Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.

Magnets & Inductors
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2since 2023
new
Power Electronics Integration

Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.

Printed Circuits & Electronic Assemblies
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1since 2023
new
Power Delivery & Battery Management

Techniques for efficiently supplying power to electronic devices, managing battery charge/discharge cycles, optimizing power consumption, and converting power between different voltage levels or AC/DC for improved energy efficiency and longevity.

Hardware Platform (Cooling, Power, Packaging)
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1since 2023
new
Network Operations, Reliability & Traffic

Techniques and systems designed to monitor network health, diagnose issues, optimize traffic flow, and ensure continuous operation and reduced downtime in complex network environments, including cloud and storage area networks.

Network Management & Monitoring
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1since 2023
new
Automated Network Provisioningfiltered

Systems and methods for automatically deploying, configuring, and updating network devices and services, including software updates, client onboarding, and topology management across various network types.

Network Management & Monitoring
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1since 2023
new
Physical Layer & Interface Optimization

Enhancements to the physical and data link layers of network communication, focusing on hardware components, signal integrity, power efficiency, and efficient data transfer mechanisms for specific interfaces and buses.

Routing, Switching & QoS
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1since 2023
new
Reference Signal Design & Optimization

Methods for designing, transmitting, and utilizing specific reference signals (e.g., DMRS, SRS, PT-RS) to enable accurate channel estimation, interference measurement, synchronization, or sensing in wireless communication systems.

Physical Transmission & Modulation
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1since 2023
new

Patents

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