Company patents
Taiwan-Asia Semiconductor Corporation
TAIWAN-ASIA SEMICONDUCTOR CORPORATION shows a surprising recent pivot, with 100% of its patenting activity occurring from 2024 onwards, and a strong emerging focus on Light-Emitting Devices (LEDs) and Photovoltaic / Photoconductive Devices, which together constitute 33.3% of its portfolio and saw significant year-over-year growth of +57.1% and +83.3% respectively so far in 2026, while categories like Medical Diagnostics & Surgery and Photovoltaic Cells (Legacy CPC) have seen a complete decline in patenting activity in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
105 US filings (since 2023) · 10 categories · 24 themes
Innovations in the internal design of individual light-emitting diode chips or packages, focusing on semiconductor layer arrangements, electrode configurations, reflective elements, and light extraction features.
Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.
Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.
Optical structures and lens designs that improve light extraction efficiency from LED dies and modules, including diffractive films, micro-lens arrays, reflectors, and color-conversion layers.
Innovations in the physical design, materials, fabrication, or packaging of photodetectors and optical sensor elements, including thermoelectric, NIR-compliant, and self-mixing interference types, to improve performance or integration.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Techniques for manufacturing semiconductor laser chips, including active region design, mirror structures, current and optical confinement, and the integration of multiple layers or elements on a substrate.
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Focuses on advanced pixel architectures, often involving vertical stacking (3D) or silicon-on-insulator (SOI) structures, to improve performance, density, or functionality of photodiodes, transistors, and floating diffusion regions within image sensor pixels.
Development and manufacturing of semiconductor devices using wide bandgap materials like Silicon Carbide (SiC) or Gallium Nitride (GaN) for high-power, high-frequency, or high-temperature applications.
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Focuses on novel semiconductor materials, heterostructures, and doping profiles to improve photovoltaic conversion efficiency, stability, and spectral response.
Focuses on the design and manufacturing of transistors where the gate material fully encircles the channel, often using nanosheets or fins, to improve electrostatic control and reduce short-channel effects.
Methods and structures for assembling laser chips into functional modules, encompassing optical alignment, electrical interconnection, mechanical support, thermal management, and encapsulation for protection.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Development of devices and methods for non-invasive or minimally invasive collection and analysis of physiological data, often from wearable sensors, to monitor health, activity, or specific conditions.
Image sensors tailored for specific advanced functionalities beyond basic image capture, such as high dynamic range (HDR) imaging, single-photon detection, auto-focus, or distance measurement (LiDAR), often incorporating specialized pixel designs or processing.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Design and integration of lasers and associated components specifically for transmitting data over optical fibers or through free space, including modulation schemes and efficient light coupling.
Design and operation of transistors optimized for memory applications, including floating body devices, ferroelectric FETs (FeFETs), vertical TFTs for 3D arrays, and charge-trapping memory cells.
LED devices and display systems designed to emit or utilize light across different spectral ranges, including visible and invisible light, or to create specific illumination patterns and immersive lighting experiences.
Specialized design and fabrication of light-emitting diodes specifically engineered to produce light in the deep ultraviolet (DUV) spectrum, often for applications like sterilization or curing.
Techniques for optimizing light capture, transmission, and internal reflection within photovoltaic devices, including surface texturing, anti-reflection coatings, and light concentration or redistribution.
Use of thermal and infrared sensors for non-contact temperature measurement, occupancy detection, structural health monitoring, fire/hazard detection, and process control in diverse industrial, environmental, and security applications.
Patents
Showing 1-10 of 105