Company patents
TAMURA CORPORATION
TAMURA CORPORATION's patent strategy reveals a surprising shift away from its largest category, Transistor & Device Structure, which has seen a dramatic decline of -100.0% so far in 2026 after an -80.0% drop in 2025. While overall patenting activity appears to be slowing, the company has maintained some focus on Magnets & Inductors, which grew by 100.0% in both 2024 and 2025 before a -75.0% decline so far in 2026, indicating a potential re-evaluation of priorities across its portfolio.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
50 US filings (since 2023) · 12 categories · 19 themes
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Development and manufacturing of semiconductor devices using wide bandgap materials like Silicon Carbide (SiC) or Gallium Nitride (GaN) for high-power, high-frequency, or high-temperature applications.
Development of novel chemical compositions for fluxes, solders, and filler metals to improve material properties, enhance joint reliability, reduce defects, or meet specific application requirements like high-temperature reflow or specialized material joining.
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.
Incorporation of novel semiconductor, dielectric, or metallic materials into transistor structures to achieve enhanced performance, new functionalities, or specific device characteristics.
Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Methods and circuits for controlling the power electronic converters (inverters, bridges) that supply current and voltage to electric motors, including switching strategies, voltage command generation, and multi-phase configurations.
Strategies and circuits for optimizing the supply and consumption of electrical power for motors, including current limiting, regenerative energy handling, battery integration, and managing power quality.
Techniques for manufacturing thin polymer layers, sheets, or multi-layer structures, often optimized for specific properties such as flexibility, barrier function, filtration, or mechanical strength.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Design and features of welding and soldering tools, fixtures, and accessories that enhance user safety, ergonomics, operational efficiency, and precise workpiece manipulation, including protective equipment and clamping mechanisms.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Methods and compositions for applying metallic or alloy layers to a substrate, or modifying the surface of an alloy, to impart specific functional properties such as corrosion resistance, wear resistance, electrical insulation, or improved adhesion, without altering the bulk properties significantly.
Patents
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