Company patents
TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
TATSUTA ELECTRIC WIRE & CABLE CO., LTD. surprisingly shows a strong focus on "Printed Circuits & Electronic Assemblies," representing 62.3% of its patent portfolio, despite a significant decline of -66.7% in this category so far in 2026. While the company has a broad materials patent portfolio, several categories like "Coating & Surface Treatment" and "Layered Products (Laminates, Films)" have seen a -100.0% decline in patenting activity so far in 2026, indicating a potential shift in priorities away from these areas.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
61 US filings (since 2023) · 12 categories · 15 themes
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Adhesive compositions specifically formulated to bind active materials within battery electrodes, emphasizing properties like electrolyte resistance, adhesion to current collectors, and processability for manufacturing.
Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.
Systems and processes for applying coatings, films, or materials onto surfaces in manufacturing or industrial contexts, often involving automated movement, surface preparation, or post-application treatment.
Materials added to polymers to modify their thermal transfer properties, typically increasing conductivity for heat dissipation in applications like electronics or battery packs.
Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.
Polymer compositions incorporating inorganic or organic filler materials to impart specific functional properties such as thermal conductivity, flame retardancy, electrical conductivity, or enhanced mechanical strength and dimensional stability.
Systems and methods for accurately controlling the volume, location, and characteristics of sprayed fluids, often involving sensors, feedback, or specific nozzle geometries for precise application.
Development of new conductive materials, including powders, composites, and alloys, designed for specific electrical performance, manufacturing processes, or applications beyond basic copper wires.
Development of adhesive compositions that are applied in a molten state and solidify upon cooling, focusing on specific polymer blends, additives, and their resulting mechanical or optical properties.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Systems specifically engineered to use sprayed liquids or aerosols for cleaning surfaces, removing residues, or distributing disinfectants in various environments.
Spraying devices designed to handle, mix, or independently dispense multiple distinct fluid components, often with mechanisms for selection, blending, or sequential application.
Patents
Showing 41-50 of 101