TDK ELECTRONICS AG

Methods and devices for integrating temperature sensors directly into materials, structures, or challenging environments (e.g., hydrogen tanks, concrete, ocean) to measure internal or localized temperatures.

Focuses on the physical design, materials, and methods for packaging capacitors and integrating them onto circuit boards, including external electrode structures, conductive adhesives, and mounting techniques to ensure reliable electrical and mechanical connections.

Explores the composition and integration of solid or gel-based electrolyte materials within various capacitor types, such as solid electrolytic capacitors and supercapacitors, to enhance performance, stability, and safety.

Focuses on the internal and external structural elements, material compositions (e.g., ceramic dielectrics, electrode metals), and manufacturing techniques used to create multilayer ceramic capacitors (MLCCs), including aspects like mechanical robustness and internal circuitry.

Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.

Focuses on the design, fabrication, and application of piezoelectric materials and devices for sensing, actuation, or wave generation, including material properties, single crystal growth, and protective layers.

Mechanical, electromagnetic, or hydraulic systems used to physically operate the contacts of a switch or circuit breaker, focusing on the linkages, motors, coils, or fluid dynamics involved.

Switches designed for specific applications within larger systems (e.g., automotive, IoT, industrial control), often incorporating sensors, control logic, wireless communication, or specialized mechanical interfaces.

Temperature sensing systems integrated into wearable devices or medical apparatus for monitoring physiological conditions, such as inflammation detection, often utilizing differential temperature measurements.

Ceramic materials and components engineered for specific functional applications, such as electronics, energy storage, wear resistance, or high-temperature heating elements.

Involves the development of novel materials and porous structures for the electrodes of supercapacitors and other electrochemical energy storage devices, aiming for high charge density, improved performance, and flexibility.

Methods and structures employed within switches and circuit breakers to safely and efficiently quench electrical arcs generated during contact separation, preventing damage and ensuring reliable interruption.

Techniques for measuring, monitoring, and compensating for temperature variations within semiconductor devices, integrated circuits, or photonic components to maintain performance, prevent degradation, and ensure reliability across operating conditions.

Measures force or pressure by detecting changes in electrical capacitance. This typically involves the deformation of a dielectric material or the relative movement of conductive plates, altering the distance or area between them.

Sensors and systems designed to detect and quantify localized contact forces, pressure distribution, or touch interactions, often employed in robotics, human-machine interfaces, or object manipulation applications.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Methods and processes for fabricating ceramic matrix composites (CMCs), including preform creation, infiltration techniques, and densification to form complex shapes with enhanced properties.

Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.

Devices and systems designed to protect electrical circuits from overcurrents, short circuits, and other faults, often involving rapid response, high voltage/current handling, and sophisticated interruption mechanisms.

Development and processing of metal powders with specific magnetic properties, including soft magnetic alloys, permanent magnet materials, and insulated powders for electronic components, often involving precise control of particle size, morphology, and composition.

Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.

Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.

Sensors that quantify strain or deformation by measuring the change in electrical resistance of a material, such as a semiconductor film or conductive layers, as it undergoes mechanical stress.

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Techniques for rendering, interacting with, and managing content within augmented or virtual reality environments, including spatial tracking, gaze interaction, and dynamic multi-application display management.

Protective layers applied to ceramic or composite substrates to enhance resistance against extreme temperatures, corrosion, or erosion in harsh operating environments.

Systems and methods designed to improve the accuracy, reliability, or operational range of sensors and electronic components by measuring temperature and applying corrections or adjustments.

Systems and sensors designed to measure the pressure difference between two distinct points or to capture rapid, transient pressure fluctuations in fluid or gas systems, often using diaphragms or pistons.

The integration of force, strain, or temperature sensors directly into large-scale structures or components (e.g., concrete, pavement, pipelines) to enable real-time health assessment, anomaly detection, and long-term performance monitoring.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.

Describes capacitors designed with actively variable capacitance, often employing phase-change materials or mechanical actuation, for use in radio frequency (RF) components, reconfigurable intelligent surfaces, and other tunable electronic systems.