Company patents
TOKIN CORPORATION
TOKIN CORPORATION's patent strategy reveals a strong, albeit fluctuating, commitment to core electronics hardware and materials, with Magnets & Inductors comprising 54.7% of its portfolio and Powder Metallurgy at 37.5%. While both categories saw significant growth in 2024 (Magnets & Inductors +40.0%, Powder Metallurgy +100.0%), the sharp declines in 2025 and so far in 2026 across most categories, including a -50.0% YoY drop in Magnets & Inductors in 2025 and a -58.3% YoY drop in Powder Metallurgy in 2025, suggest a shifting priority or a period of strategic re-evaluation, despite a notable 200.0% YoY surge in Capacitors in 2025.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
64 US filings (since 2023) · 10 categories · 18 themes
Development and processing of metal powders with specific magnetic properties, including soft magnetic alloys, permanent magnet materials, and insulated powders for electronic components, often involving precise control of particle size, morphology, and composition.
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Explores the composition and integration of solid or gel-based electrolyte materials within various capacitor types, such as solid electrolytic capacitors and supercapacitors, to enhance performance, stability, and safety.
Focuses on the physical design, materials, and methods for packaging capacitors and integrating them onto circuit boards, including external electrode structures, conductive adhesives, and mounting techniques to ensure reliable electrical and mechanical connections.
Focuses on the internal and external structural elements, material compositions (e.g., ceramic dielectrics, electrode metals), and manufacturing techniques used to create multilayer ceramic capacitors (MLCCs), including aspects like mechanical robustness and internal circuitry.
Involves the development of novel materials and porous structures for the electrodes of supercapacitors and other electrochemical energy storage devices, aiming for high charge density, improved performance, and flexibility.
Composite materials where a metallic matrix is reinforced with a second phase (e.g., ceramic particles, carbon nanotubes, diamond grains) to significantly enhance properties like hardness, wear resistance, stiffness, or strength, often used in cutting tools, wear parts, or structural applications.
Systems and devices that utilize controlled magnetic fields, often generated by electromagnets, to produce mechanical motion, precise positioning, or manipulate physical phenomena like plasma distribution.
Methods and compositions for applying metallic or alloy layers to a substrate, or modifying the surface of an alloy, to impart specific functional properties such as corrosion resistance, wear resistance, electrical insulation, or improved adhesion, without altering the bulk properties significantly.
Techniques for building three-dimensional metal objects layer-by-layer using metal powders, including powder bed fusion, binder jetting, and directed energy deposition. This theme encompasses process mechanics, equipment design, and operational control for AM systems.
Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Innovations in the physical design, materials, fabrication, or packaging of photodetectors and optical sensor elements, including thermoelectric, NIR-compliant, and self-mixing interference types, to improve performance or integration.
Use of thermal and infrared sensors for non-contact temperature measurement, occupancy detection, structural health monitoring, fire/hazard detection, and process control in diverse industrial, environmental, and security applications.
Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.
Techniques and structures used to reduce unwanted electromagnetic coupling, scattering, or interference between multiple antennas, different frequency bands, or sensitive electronic components within a device.
Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Patents
Showing 1-10 of 89