Company patents
TOWA CORPORATION
TOWA CORPORATION's patent strategy is heavily concentrated in "Plastics Shaping & Molding," which accounts for 76.2% of its portfolio, yet saw a significant decline of 53.3% in 2025 and a further 14.3% so far in 2026 after a surge in 2024. Surprisingly, despite its core manufacturing focus, the company has shown a shifting priority away from semiconductor-related categories like "Semiconductor Manufacturing Process" and "Semiconductor Packaging & Encapsulation," both experiencing 100.0% declines so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
42 US filings (since 2023) · 8 categories · 12 themes
Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.
Methods and equipment for continuously shaping plastic materials by forcing them through a die, often involving screw extruders, heating elements, and downstream calibration.
Processes involving the application of heat and pressure to shape thermoplastic or elastomeric materials, often using molds or presses, to achieve specific forms or material properties.
Techniques and systems utilizing laser beams for precise material modification, including cutting, cladding, ablation, and surface treatment, often for joining, shaping, or removing material.
Methods and tooling for forming structural components from fibrous materials impregnated with resin, involving processes like prepreg handling, resin infusion, and co-bonding during curing.
Methods and apparatus for cleaning polishing pads, dressers, chamber components, or finished substrates to remove residues, debris, or contaminants, often involving specialized nozzles, fluids, or mechanical actions.
Design and application of abrasive tools and deburring heads tailored for specific geometries, materials, or access constraints, including flexible, expandable, or multi-component designs for precision finishing.
Manufacturing methods for optical components such as lenses, waveguides, films, and filters, requiring high precision in molding, surface treatment, or material composition to achieve specific optical properties like refractive index, microstructures, or tinting.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Systems and methods for precisely controlling welding parameters such as power, speed, oscillation, and material feed to optimize weld quality, consistency, and efficiency, often involving automated or semi-automated processes.
Techniques and devices for measuring, monitoring, and controlling the surface topography, film thickness, or other characteristics of a workpiece during or after grinding/polishing to achieve specific finish requirements.
Mechanisms and control systems for reliably feeding, conveying, and separating print media, including managing media roll changes, adjusting airflow, and adapting to different media characteristics.
Patents
Showing 1-3 of 3
Laser Material Processing