UnfoldIPThemes

Company patents

TPK Advanced Solutions Inc.

TPK Advanced Solutions Inc. shows a surprising shift in its patent strategy, moving away from its dominant "Input/Output & User Interfaces" category, which represents 80.6% of its portfolio but has seen a consistent decline in new patents since 2023, including a -28.6% YoY drop so far in 2026. Concurrently, the company is rapidly emerging in "Hardware Platform (Cooling, Power, Packaging)" with a significant 200.0% YoY growth in 2026, indicating a strategic pivot towards underlying computing infrastructure.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

62 US filings (since 2023) · 12 categories · 11 themes

Integrated Touch Sensors

Methods and structures for incorporating touch sensing capabilities directly into OLED display panels, typically involving conductive layers and insulating layers within or on top of the display stack.

Organic Electronics (OLED)
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40since 2023
-14.3%YoY
Flexible/Foldable Device Structures

Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.

Hardware Platform (Cooling, Power, Packaging)Organic Electronics (OLED)
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16since 2023
0.0%YoY
Display Panel Manufacturing & Encapsulation

Techniques and structural designs for fabricating the physical layers of an OLED display, including material deposition, patterning, and methods to protect the active organic layers from environmental degradation like moisture and oxygen.

Organic Electronics (OLED)
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12since 2023
new
Advanced Display Backlight & Optics

Innovations in backlight units, optical films, and light management structures to enhance display performance, uniformity, viewing experience, or specific functionalities like touch.

Liquid Crystal & Optical Modulators
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7since 2023
new
Flexible Electronic Films & Electrodes

Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.

Layered Products (Laminates, Films)
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7since 2023
n/a
Flexible and Printed Circuitry

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Printed Circuits & Electronic Assemblies
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7since 2023
n/a
Advanced Electronic Packaging

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
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6since 2023
new
Device Enclosure & Material Engineeringfiltered

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Printed Circuits & Electronic Assemblies
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5since 2023
n/a
Electrophoretic Display Control

Techniques for driving electrophoretic displays, including managing remnant voltage, optimizing particle movement, and specific addressing pulse schemes to improve optical quality and update speed.

Liquid Crystal & Optical Modulators
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2since 2023
new
Integrated Display & Illumination

Systems that combine light sources, waveguides, and display elements into unified products for backlighting, automotive applications, general lighting, or color-corrected displays.

Optical Elements & Systems
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2since 2023
new
Specialized Conductor Formulations

Development of new conductive materials, including powders, composites, and alloys, designed for specific electrical performance, manufacturing processes, or applications beyond basic copper wires.

Cables & Conductors
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2since 2023
n/a

Patents

Showing 1-10 of 10

Device Enclosure & Material Engineering
Page 1 of 1
US 11853516 B2GRANTED
G06F3/044

Protective assembly and touch module

Filed:2021-12-14Pub:2023-12-26
Applicant:TPK Advanced Solutions Inc.

A protective assembly includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 μm to about 15 μm, and a Poisson's ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from about 3 μm to about 10 μm and a Young's coefficient ranging from about 1 GPa to about 10 GPa.

US 11785730 B2GRANTED
H05K5/02

Foldable electronic device including a chain and at least one elastic padding

Filed:2021-07-28Pub:2023-10-10
Applicant:TPK Advanced Solutions Inc.

A foldable electronic device includes a frame, a flexible component disposed on the frame, and a hinge device. The hinge device includes a chain and at least one elastic padding. The chain is connected to the frame and includes a plurality of chain units. The elastic padding is disposed in at least one of the chain units or encapsulates at least one of the chain units.

US 20230185410 A1APPLICATION
G06F3/044

PROTECTIVE ASSEMBLY AND TOUCH MODULE

Filed:2021-12-14Pub:2023-06-15
Applicant:TPK Advanced Solutions Inc.

A protective assembly includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 μm to about 15 μm, and a Poisson's ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from about 3 μm to about 10 μm and a Young's coefficient ranging from about 1 GPa to about 10 GPa.

US 11647645 B2GRANTED
G06F3/041

Cover plate used in electronic device, electronic device, and method of manufacturing cover plate

Filed:2021-01-13Pub:2023-05-09
Applicant:TPK Advanced Solutions Inc.

A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.

US 20230031086 A1APPLICATION
H05K5/02

FOLDABLE ELECTRONIC DEVICE

Filed:2021-07-28Pub:2023-02-02
Applicant:TPK Advanced Solutions Inc.

A foldable electronic device includes a frame, a flexible component disposed on the frame, and a hinge device. The hinge device includes a chain and at least one elastic padding. The chain is connected to the frame and includes a plurality of chain units. The elastic padding is disposed in at least one of the chain units or encapsulates at least one of the chain units.

US 11493809 B2GRANTED
G02F1/1343

Electronic curtain and electronic device

Filed:2021-01-14Pub:2022-11-08
Applicant:TPK Advanced Solutions Inc.

An electronic curtain includes a first electrode, a second electrode, and an electrochromic element. At least one of the first electrode or the second electrode includes a plurality of conductive layers stacked and in contact with each other. The electrochromic element is sandwiched between the first electrode and the second electrode.

US 20220223816 A1APPLICATION
H01L51/52

COVER PLATE USED IN ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING COVER PLATE

Filed:2021-01-13Pub:2022-07-14
Applicant:TPK Advanced Solutions Inc.

A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.

US 20220221762 A1APPLICATION
G02F1/1343

ELECTRONIC CURTAIN AND ELECTRONIC DEVICE

Filed:2021-01-14Pub:2022-07-14
Applicant:TPK Advanced Solutions Inc.

An electronic curtain includes a first electrode, a second electrode, and an electrochromic element. At least one of the first electrode or the second electrode includes a plurality of conductive layers stacked and in contact with each other. The electrochromic element is sandwiched between the first electrode and the second electrode.

US 11294518 B1GRANTED
G06F3/044

Touch panel and device thereof

Filed:2020-09-15Pub:2022-04-05
Applicant:TPK Advanced Solutions Inc.

The present disclosure relates to the field of touch technology, and provides a touch display module including a substrate, a transparent conductive layer, a moisture barrier layer, and a display element. The transparent conductive layer is disposed on the substrate. The moisture barrier layer extends laterally on the transparent conductive layer and covers the transparent conductive layer, and the moisture barrier layer includes inorganic materials. The display element is disposed on the moisture barrier layer. The touch display module of the present disclosure can avoid or slow down the water vapor/humidity intrusion from the environment, thereby meeting the specification requirements for improving product reliability test.

US 20220083170 A1APPLICATION
G06F3/044

TOUCH PANEL AND DEVICE THEREOF

Filed:2020-09-15Pub:2022-03-17
Applicant:TPK Advanced Solutions Inc.

The present disclosure relates to the field of touch technology, and provides a touch display module including a substrate, a transparent conductive layer, a moisture barrier layer, and a display element. The transparent conductive layer is disposed on the substrate. The moisture barrier layer extends laterally on the transparent conductive layer and covers the transparent conductive layer, and the moisture barrier layer includes inorganic materials. The display element is disposed on the moisture barrier layer. The touch display module of the present disclosure can avoid or slow down the water vapor/humidity intrusion from the environment, thereby meeting the specification requirements for improving product reliability test.

1