Company patents
TRUMPF Laser GmbH
TRUMPF Laser GmbH's patent strategy reveals a surprising and strong focus on "Welding & Soldering," which constitutes 50.0% of its portfolio and saw significant growth of +66.7% in 2025, despite a sharp decline so far in 2026. While "Lasers" remains a core area (39.3% of portfolio), the company appears to be shifting priorities away from "Liquid Crystal & Optical Modulators" and "Length / Distance Measurement," both showing substantial declines in recent years, with no new patents so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
84 US filings (since 2023) · 6 categories · 16 themes
Techniques and systems utilizing laser beams for precise material modification, including cutting, cladding, ablation, and surface treatment, often for joining, shaping, or removing material.
Systems and methods for precisely controlling welding parameters such as power, speed, oscillation, and material feed to optimize weld quality, consistency, and efficiency, often involving automated or semi-automated processes.
Systems and components related to fiber lasers and fiber optical amplifiers, including doped fibers, pump schemes, and specialized fiber structures for gain, filtering, or thermal management.
Design and integration of lasers and associated components specifically for transmitting data over optical fibers or through free space, including modulation schemes and efficient light coupling.
Techniques and systems for ensuring the safe and precise operation of lasers, including power regulation, hazard detection, and deconfliction mechanisms in complex or dynamic environments.
Mechanisms and designs for actively changing or stabilizing the output wavelength, frequency, or spectral properties of a laser, often involving integrated optical filters, resonators, or pump adjustments.
Methods and structures for assembling laser chips into functional modules, encompassing optical alignment, electrical interconnection, mechanical support, thermal management, and encapsulation for protection.
Systems and methods for assessing the quality and characteristics of welds or solder joints, often involving non-destructive testing (NDT) techniques, image processing, or real-time feedback for process control and defect detection.
Techniques for manufacturing semiconductor laser chips, including active region design, mirror structures, current and optical confinement, and the integration of multiple layers or elements on a substrate.
Design and features of welding and soldering tools, fixtures, and accessories that enhance user safety, ergonomics, operational efficiency, and precise workpiece manipulation, including protective equipment and clamping mechanisms.
Techniques and systems for measuring three-dimensional shapes, depths, or surface profiles using optical principles, including diffraction, interferometry, structured light, and imaging.
Techniques and apparatus for measuring and verifying the performance, properties, and structural integrity of optical components like lenses, waveguides, and optical fibers. This includes loss, refractive index, and physical defects.
Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.
Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.
Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.
Systems and methods for accurately measuring and compensating for position, orientation, and movement errors in mechanical systems, often for manufacturing, robotics, or optical alignment.
Patents
Showing 1-10 of 21
Laser Module Packaging