Company patents
Versum Materials US, LLC
Versum Materials US, LLC exhibits a patent strategy heavily focused on "Coating & Surface Treatment" (54.3% of portfolio) and "Semiconductor Manufacturing Process" (42.3%), with a surprising emerging focus in "Acyclic / Cyclic Compounds (Other Elements)" which saw a significant 66.7% YoY growth in 2025, despite a subsequent decline so far in 2026. While "Coating & Surface Treatment" and "Semiconductor Manufacturing Process" have seen substantial declines in 2026 (YoY -57.1% and -77.8% respectively), it's important to note that 2026 data is partial.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
175 US filings (since 2023) · 11 categories · 16 themes
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Abrasive slurry compositions used in semiconductor manufacturing for planarizing wafer surfaces, typically containing abrasive particles and chemical additives to achieve specific material removal rates and selectivity.
Processes involving chemical and mechanical forces to planarize surfaces (CMP) or wet chemical treatments for cleaning, etching, or material removal, often utilizing specialized compositions, nozzles, or fluid management systems.
Focuses on the chemical and physical properties of polishing slurries and the design of polishing pads, including their material composition, groove patterns, and thermal characteristics, to optimize chemical-mechanical planarization processes.
Synthesis and modification of polysiloxane polymers to introduce specific functional groups or structures, enhancing properties for applications like composites, coatings, biomedical uses, or powder treatment.
Synthesis and processing of silicon and silicon carbide materials in various forms (e.g., particles, nanowires, films) for applications beyond traditional semiconductors, such as battery components, refractories, or advanced electronics.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Development of novel chemical compositions for photoresists, including polymers, sensitizers, and crosslinking agents, to achieve improved lithographic performance such as resolution, sensitivity, line edge roughness, and etch resistance.
Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.
Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.
Organometallic or organosilicon compounds used as catalysts to facilitate polymerization reactions, such as olefin metathesis, or as crosslinkers and modifiers to enhance the properties of polymer compositions like silicones.
Methods and apparatus for cleaning polishing pads, dressers, chamber components, or finished substrates to remove residues, debris, or contaminants, often involving specialized nozzles, fluids, or mechanical actions.
Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.
Technologies and systems for removing unwanted components or separating desired gases from a mixed gas stream, including adsorption, absorption, and membrane-based methods.
Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.
Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.
Patents
Showing 1-10 of 30
Advanced Etching & Patterning Control