Company patents
WIWYNN CORPORATION
WIWYNN CORPORATION's patent strategy is heavily concentrated in Printed Circuits & Electronic Assemblies, which accounts for 63.1% of its portfolio and saw a significant 146.2% YoY growth in 2024, indicating a strong and sustained focus in this core area. Surprisingly, despite this core strength, several smaller categories like Computer Hardware Architecture and Electrical Connectors have seen a complete cessation of new patenting activity so far in 2026, suggesting a rapid shift away from these areas.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
168 US filings (since 2023) · 11 categories · 12 themes
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Techniques for efficiently supplying power to electronic devices, managing battery charge/discharge cycles, optimizing power consumption, and converting power between different voltage levels or AC/DC for improved energy efficiency and longevity.
Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.
Technologies for establishing and managing high-bandwidth, low-latency communication pathways between computing components, peripherals, or systems, focusing on signal integrity, synchronization, and interface standards.
Containers or packaging components featuring active mechanisms for controlled release, preparation, or delivery of their contents, such as liquids, bulk materials, volatile compounds, or single-serve portions.
Conductive bars or plates used for efficient power distribution within electrical apparatus, often featuring specific designs for connection, thermal management, or modularity to reduce material costs and increase rigidity.
Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Household articles engineered with mechanisms for folding, retracting, or collapsing to reduce their footprint, facilitate storage, or enable portability.
Patents
Showing 1-10 of 21
Device Enclosure & Material Engineering