Company patents
XILINX, INC.
XILINX, INC. appears to be strategically shifting its focus, as evidenced by significant declines across many of its core computing and semiconductor categories in 2025 and so far in 2026, such as Computer Hardware Architecture (down 26.0% in 2025) and Electronic Design Automation (CAD/EDA) (down 25.0% in 2025). While most categories show a decline, Machine Learning & AI stands out as an emerging focus, with a robust 33.3% growth so far in 2026, indicating a pivot towards advanced AI integration despite representing only 6.5% of its total portfolio.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
911 US filings (since 2023) · 12 categories · 36 themes
Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.
Novel hardware designs and processing pipelines tailored for specific computational tasks, such as graphics rendering, neural network operations, or matrix transformations, often involving custom circuits, memory arrays, or data flow mechanisms.
Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.
Hardware and control techniques for optimizing memory access latency, ensuring data integrity, and managing storage resources efficiently. This includes error correction, read/write voltage control, and intelligent data placement or in-memory computation.
Specialized hardware, architectural designs, and computational methods to improve the speed, efficiency, and security of artificial intelligence and machine learning model execution, particularly for inference and data processing.
Technologies for establishing and managing high-bandwidth, low-latency communication pathways between computing components, peripherals, or systems, focusing on signal integrity, synchronization, and interface standards.
Automated methods and tools for generating, optimizing, and verifying the physical layout and interconnections of electronic components, including integrated circuits, printed circuit boards, and system-level interface protection.
Enhancements to the physical and data link layers of network communication, focusing on hardware components, signal integrity, power efficiency, and efficient data transfer mechanisms for specific interfaces and buses.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Techniques and circuits designed to identify, compensate for, or correct non-linearities, offsets, and other imperfections in signal processing paths, particularly within analog-to-digital, digital-to-analog, or digital-to-time converters.
Integrated circuits or sub-circuits designed to regulate, balance, or protect power delivery within a device, often involving specific transistor and capacitor arrangements.
Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.
Methods and systems for efficiently reducing the size of digital data, often employing adaptive techniques, neural networks, or temporal modeling, to achieve high compression ratios while preserving data quality. Includes entropy coding.
Focuses on the architectural and circuit-level innovations for Analog-to-Digital Converters (ADCs) and Digital-to-Analog Converters (DACs) to improve speed, accuracy, linearity, and power efficiency. Includes specific types like SAR and Delta-Sigma, and their constituent components.
Digital logic circuits designed to interface with analog sensors or signals, including comparators, input buffers, differential input stages, and logic for processing sensor outputs (e.g., capacitance, optical, touch) for detection or measurement.
Techniques and systems for optimizing network traffic flow, distributing loads across multiple paths or resources, and ensuring quality of service based on various criteria like application type, latency, or resource availability. This includes dynamic path selection, congestion control, and resource allocation.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Development of encoding and decoding algorithms and apparatuses for robust data transmission and storage, focusing on techniques like LDPC, polar codes, and iterative decoding methods to minimize bit errors and improve communication reliability.
Methods and architectures for processing digital signals to enhance quality, remove noise, manage group delay, and facilitate symbol decision, often involving digital filters and equalization techniques.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Creating virtual models (digital twins) of complex physical systems to simulate their behavior, predict performance, validate designs, or guide operations under various conditions.
Developing and applying machine learning algorithms that leverage quantum computing principles, such as quantum circuits or autoencoders, for tasks like simulation or data processing.
Using computational design and simulation to optimize the performance characteristics of specific components or materials within a larger engineering system.
Specialized digital and mixed-signal circuits for controlling and reading out quantum bits (qubits), including generating precise modulated RF signals and integrating with photonic components for quantum operations.
Systems and methods for automating the lifecycle of machine learning models, including pipeline deployment, model management, versioning, and configuring for different inference environments.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Methods for training machine learning models across multiple decentralized devices or servers while keeping data localized, often involving aggregation of model parameters and secure communication.
Methods and systems for efficiently allocating computing resources, balancing workloads, and managing power states to improve performance, reduce energy consumption, or enhance reliability in computing platforms.
Techniques and systems designed to monitor network health, diagnose issues, optimize traffic flow, and ensure continuous operation and reduced downtime in complex network environments, including cloud and storage area networks.
Technologies enabling the creation and management of virtual computing environments, including virtual machines and virtual desktops, with an emphasis on secure and efficient remote access, updates, and performance.
Techniques for generating human-like text or other content using large pre-trained models, often involving prompt engineering, speculative decoding, or multi-modal inputs for content creation.
Utilizing machine learning, particularly deep learning, to analyze medical data such as images, sensor readings, or physiological signals for disease prediction, diagnosis, or treatment assessment.
Computational methods for modeling and simulating photolithography processes, including mask design, aerial image generation, and defect prediction for semiconductor manufacturing.
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
Systems and methods for automating multi-step tasks, business processes, or service interactions, often involving AI agents, programmable interfaces, or formal orchestration languages to streamline operations.
Encompasses strategies and technologies to ensure the availability, integrity, and recoverability of data and systems, including robust backup, replication, error correction, and efficient data restoration.
Patents
Showing 1-10 of 22
Advanced Channel Coding & Decoding