Zhuhai ACCESS Semiconductor Co., Ltd

A packaging structure includes multiple packaging units, and the packaging units include a hard plate region, a winding region, and a fan-out region. In the packaging structure, the hard plate region of the packaging unit is arranged in a stacked manner, some or all of the fan-out regions are packaged with a chip, and some or all of the fan-out regions packaged with a chip are stacked with the hard plate regions after being bent by the winding region. So designed, each fan-out region is individually packaged and then packaged by stacking with each other to achieve the interconnections between a chip and a chip, and between a chip and a substrate without interference between the packaging units.

An embedded and packaged heat dissipation structure and a manufacturing method therefor, and a semiconductor are disclosed. The method includes: forming a first semi-finished plate; forming a heat dissipation plate based on the first metal layer; manufacturing a heat dissipation copper column on the heat dissipation plate; providing a dielectric layer; laminating a second metal layer on the dielectric layer; partially etching the second metal layer and the dielectric layer to form a microchannel; manufacturing a thin metal layer to enable an inner wall of the microchannel to form an isolation layer with an integrated structure to obtain a second semi-finished plate; manufacturing a first cover layer; and laminating the first cover layer and the second semi-finished plate to connect the first cover layer and the isolation layer in a sealed manner to obtain the embedded and packaged heat dissipation structure.

A package substrate with an embedded device and a manufacturing method therefor are disclosed. The method includes: manufacturing a third circuit layer and a target on a temporary carrier plate, and laminating a third dielectric layer; placing a device to be embedded on the third dielectric layer which is then covered with a second dielectric layer; laminating a second copper foil and manufacturing a second circuit layer, a second copper pillar, and a third copper pillar; laminating a first dielectric layer and a first copper foil sequentially, and removing the temporary carrier plate; laminating a fourth dielectric layer on the third circuit layer; laminating a fourth copper foil on the fourth dielectric layer; and manufacturing a fourth circuit layer and a fourth copper pillar through the fourth copper foil, and manufacturing a first circuit layer and a first copper pillar through the first copper foil.

A package substrate and a manufacturing method thereof are disclosed. The method includes: providing an inner substrate; processing an adhesive photosensitive material on a surface of a first side of the inner substrate to obtain an adhesive first insulating dielectric layer; mounting a component on the first insulating dielectric layer; and processing a photosensitive packaging material on the first side of the inner substrate to obtain a second insulating dielectric layer, where the second insulating dielectric layer covers the component.

A signal-heat separated TMV packaging structure includes an insulating dielectric material, an inner signal line layer arranged in the insulating dielectric material, an outer signal line layer, a heat dissipation metal face and a chip. A first side of the insulating dielectric material is provided with an isolating layer. The outer signal line layer is arranged on a surface of a second side of the insulating dielectric material and is connected with the inner signal line layer through a TMV structure. The heat dissipation metal face is arranged on a surface of the first side of the insulating dielectric material, and is separated from the inner signal line layer. The chip is embedded in the insulating dielectric material, with an active face in electrically-conductive connection with the inner signal line layer and a passive face in heat transfer connection with the heat dissipation metal face.

A two-sided interconnected embedded chip packaging structure includes a first insulating layer and a second insulating layer. The first insulating layer includes a first conductive copper column layer penetrating through the first insulating layer in a height direction and a first chip located between adjacent first conductive copper columns, and the first chip is attached to the inside of the lower surface of the first insulating layer. The second insulating layer includes a first conductive wire layer and a heat radiation copper surface which are located in the upper surface of the second insulating layer, the first conductive wire layer is provided with a second conductive copper column layer, the first conductive copper column layer is connected with the first conductive wire layer, and the heat radiation copper surface is connected with the reverse side of the first chip.

A method for manufacturing a light-emitting photosensitive sensor structure includes preparing a package substrate, wherein the package substrate has a cavity formed by a light-shield frame performing enclosing, and the bottom of the cavity is provided with a first line layer, forming a light transmission channel on the light-shield frame, mounting a light-emitting photosensitive sensor in the cavity of the package substrate so that the photosensitive luminescent device is electrically connected to the first line layer, filling the cavity and the light transmission channel with a transparent encapsulating material to form a transparent packaging layer on the photosensitive luminescent device, forming a light-shield layer on the transparent packaging layer, and performing cutting along a cutting line of the light-shield frame to obtain a light-emitting photosensitive sensor structure having a directional light transmission channel.

A package substrate based on a molding process may include an encapsulation layer, a support frame located in the encapsulation layer, a base, a device located on an upper surface of the base, a copper boss located on a lower surface of the base, a conductive copper pillar layer penetrating the encapsulation layer in the height direction, and a first circuit layer and a second circuit layer over and under the encapsulation layer. The second circuit layer includes a second conductive circuit and a heat dissipation circuit, the first circuit layer and the second conductive circuit are connected conductively through the conductive copper pillar layer, the heat dissipation circuit is connected to one side of the device through the copper boss and the base, and the first circuit layer is connected to the other side of the device.

An embedded packaging structure and a manufacturing method thereof are disclosed. The method includes: providing a bearing plate with a first metal seed layer; processing on the first metal seed layer to obtain a substrate; removing the bearing plate to obtain the substrate, and processing on the substrate to obtain a first and a second cavities penetrating therethrough; assembling a first component in the first cavity, assembling a connecting flexible board in the second cavity, processing on a second side of the substrate to obtain a second insulating layer; processing on a first side of the substrate to obtain a second circuit layer, assembling a second component on the second circuit layer; bending the substrate through the connecting flexible board to form an included angle less than 180 degrees on the first side, and packaging the first side by using a packaging material to obtain a packaging layer.

A liquid circulating cooling package substrate includes a circulating cooling structure including a cooling chamber in a first dielectric layer to expose a heat dissipation face, a metal heat dissipation layer on the inner surface of the cooling chamber, an upright support column formed on a metal heat dissipation layer, and a cooling cover supported on the support column to close the cooling chamber along the periphery of the cooling chamber. The metal heat dissipation layer completely covers the heat dissipation face and the inner side surface of the cooling chamber, and a liquid inlet and a liquid outlet are formed on the cooling cover. A circulating cooling structure is provided in the first dielectric layer, and the circulating cooling structure is formed during the processing of an embedded package substrate such that the processing flow is simple and the cost is low.