Patent Theme

Advanced Metallization & Contacts

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

23,733 US filings from 2,140 companies since 2023 · 2023: 5,142 · 2024: 6,488 · 2025: 8,183 · 2026 YTD: 3,920

Chip-to-Chip Interconnect (Bonding, Bumps)Semiconductor Diodes & Transistors

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#CompanySince 20232023202420252026 YTDYoY
1Taiwan Semiconductor Manufacturing Company, Ltd.2,9015356891,191486+72.9%
2SAMSUNG ELECTRONICS CO., LTD.2,090371516712491+38.0%
3Taiwan Semiconductor Manufacturing Co., Ltd.1,829448584632165+8.2%
4Applied Materials, Inc.989239326290134-11.0%
5NANYA TECHNOLOGY CORPORATION955222249352132+41.4%
6International Business Machines Corporation708163178237130+33.1%
7INTEL CORPORATION62813918121197+16.6%
8ASM IP Holding B.V.54012014818191+22.3%
9CHANGXIN MEMORY TECHNOLOGIES, INC.41814613611323-16.9%
10TOKYO ELECTRON LIMITED345827813451+71.8%
11UNITED MICROELECTRONICS CORP.335594614288+208.7%
12TEXAS INSTRUMENTS INCORPORATED330639010275+13.3%
13FUJI ELECTRIC CO., LTD.313447311680+58.9%
14Micron Technology, Inc.31184959141-4.2%
15SK hynix Inc.310399010477+15.6%
16ROHM CO., LTD.30381729852+36.1%
17Mitsubishi Electric Corporation27263699248+33.3%
18Lam Research Corporation22343728028+11.1%
19KABUSHIKI KAISHA TOSHIBA204182510160+304.0%
20Taiwan Semiconductor Manufacturing Company Limited19950627215+16.1%
21Toshiba Electronic Devices & Storage Corporation17212208753+335.0%
22RENESAS ELECTRONICS CORPORATION16540245249+116.7%
23Infineon Technologies AG16346405324+32.5%
24DENSO CORPORATION13218265731+119.2%
25SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC13021385417+42.1%