Patent Theme

Backside Contact & Interconnects

Techniques for forming electrical contacts, vias, and interconnects to semiconductor devices, including advanced methods like contact-over-active-gate (COAG) and backside contacts for improved density and performance.

5,324 US filings from 474 companies since 2023 · 2023: 1,352 · 2024: 1,951 · 2025: 1,635 · 2026 YTD: 386

Transistor & Device Structure

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#	Company	Since 2023	2023	2024	2025	2026 YTD	YoY
1	Taiwan Semiconductor Manufacturing Company, Ltd.	813	192	280	296	45	+5.7%
2	SAMSUNG ELECTRONICS CO., LTD.	639	127	254	178	80	-29.9%
3	International Business Machines Corporation	544	105	212	183	44	-13.7%
4	Taiwan Semiconductor Manufacturing Co., Ltd.	542	168	195	164	15	-15.9%
5	INTEL CORPORATION	327	90	125	94	18	-24.8%
6	NANYA TECHNOLOGY CORPORATION	186	52	50	59	25	+18.0%
7	Micron Technology, Inc.	125	32	52	30	11	-42.3%
8	FUJI ELECTRIC CO., LTD.	123	31	47	40	5	-14.9%
9	CHANGXIN MEMORY TECHNOLOGIES, INC.	91	34	29	22	6	-24.1%
10	Applied Materials, Inc.	88	17	26	32	13	+23.1%
11	Infineon Technologies AG	72	25	19	26	2	+36.8%
12	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC	60	13	19	24	4	+26.3%
13	ROHM CO., LTD.	59	17	24	16	2	-33.3%
14	RENESAS ELECTRONICS CORPORATION	57	21	17	11	8	-35.3%
15	SK hynix Inc.	57	14	17	18	8	+5.9%
16	Taiwan Semiconductor Manufacturing Company Limited	53	15	16	18	4	+12.5%
17	UNITED MICROELECTRONICS CORP.	53	17	10	19	7	+90.0%
18	GlobalFoundries U.S. Inc.	45	24	12	9	·	-25.0%
19	TEXAS INSTRUMENTS INCORPORATED	44	12	16	15	1	-6.2%
20	Kioxia Corporation	43	12	17	11	3	-35.3%
21	QUALCOMM Incorporated	42	3	18	17	4	-5.6%
22	KABUSHIKI KAISHA TOSHIBA	37	11	15	7	4	-53.3%
23	Infineon Technologies Austria AG	33	9	14	9	1	-35.7%
24	Mitsubishi Electric Corporation	32	7	15	10	·	-33.3%
25	Toshiba Electronic Devices & Storage Corporation	31	10	12	5	4	-58.3%