Patent Theme

Heterogeneous Chiplet Integration

Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.

10,278 US filings from 1,096 companies since 2023 · 2023: 2,349 · 2024: 3,143 · 2025: 3,398 · 2026 YTD: 1,388

Multi-Chip & 3D AssembliesMemory Devices (Structural)

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#CompanySince 20232023202420252026 YTDYoY
1SAMSUNG ELECTRONICS CO., LTD.1,890391565652282+15.4%
2INTEL CORPORATION76120924822381-10.1%
3Micron Technology, Inc.56617417415662-10.3%
4Taiwan Semiconductor Manufacturing Company, Ltd.50913514719037+29.3%
5Advanced Micro Devices, Inc.3256210111448+12.9%
6DELL PRODUCTS L.P.3174110912344+12.8%
7QUALCOMM Incorporated22134519541+86.3%
8SK hynix Inc.20150585637-3.4%
9XILINX, INC.16946613923-36.1%
10International Business Machines Corporation16350414824+17.1%
11TEXAS INSTRUMENTS INCORPORATED143424444130.0%
12Taiwan Semiconductor Manufacturing Co., Ltd.14128515210+2.0%
13Apple Inc.13037403518-12.5%
14Huawei Technologies Co., Ltd.11630273425+25.9%
15GOOGLE LLC11117404113+2.5%
16Rambus Inc.10221343017-11.8%
17Kioxia Corporation9021322710-15.6%
18Nvidia Corporation8011133818+192.3%
19MEDIATEK INC.7321271411-48.1%
20ATI TECHNOLOGIES ULC7214291910-34.5%
21Microsoft Technology Licensing, LLC7225151913+26.7%
22SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC711329236-20.7%
23Infineon Technologies AG702024197-20.8%
24iCometrue Company Ltd.6315132411+84.6%
25Western Digital Technologies, Inc.59232016·-20.0%