Patent Theme

High-Speed Data Interconnects

Technologies for establishing and managing high-bandwidth, low-latency communication pathways between computing components, peripherals, or systems, focusing on signal integrity, synchronization, and interface standards.

7,833 US filings from 1,222 companies since 2023 · 2023: 2,096 · 2024: 2,294 · 2025: 2,384 · 2026 YTD: 1,059

Computer Hardware ArchitectureMulti-Chip & 3D Assemblies

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#CompanySince 20232023202420252026 YTDYoY
1INTEL CORPORATION40411711413241+15.8%
2SAMSUNG ELECTRONICS CO., LTD.335948411740+39.3%
3DELL PRODUCTS L.P.322878610940+26.7%
4Huawei Technologies Co., Ltd.296901016738-33.7%
5QUALCOMM Incorporated21021658836+35.4%
6TEXAS INSTRUMENTS INCORPORATED19053625619-9.7%
7Mellanox Technologies, Ltd.15129544424-18.5%
8Marvell Asia Pte Ltd12735443711-15.9%
9Cisco Technology, Inc.12431324417+37.5%
10SK hynix Inc.11826334712+42.4%
11Western Digital Technologies, Inc.1125045161-64.4%
12Nvidia Corporation10324213721+76.2%
13International Business Machines Corporation10237252317-8.0%
14Apple Inc.9630292017-31.0%
15Micron Technology, Inc.8920282615-7.1%
16Advanced Micro Devices, Inc.8623262512-3.8%
17Robert Bosch GmbH852919289+47.4%
18Hewlett Packard Enterprise Development LP77192121160.0%
19XILINX, INC.752526177-34.6%
20Microsoft Technology Licensing, LLC7418182612+44.4%
21Amazon Technologies, Inc.641619245+26.3%
22Rambus Inc.591417226+29.4%
23Microchip Technology Incorporated5714161413-12.5%
24Sandisk Technologies, Inc.57·82920+262.5%
25GOOGLE LLC561620155-25.0%