Patent Theme
Interconnect Materials & Reliability
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
4,976 US filings from 821 companies since 2023 · 2023: 1,256 · 2024: 1,562 · 2025: 1,690 · 2026 YTD: 468
Chip-to-Chip Interconnect (Bonding, Bumps)
Top companies
Ranked by filings in this theme since 2023. 2026 is partial.
| # | Company | Since 2023 | 2023 | 2024 | 2025 | 2026 YTD | YoY |
|---|
| 1 | SAMSUNG ELECTRONICS CO., LTD. | 871 | 170 | 244 | 342 | 115 | +40.2% |
| 2 | Taiwan Semiconductor Manufacturing Company, Ltd. | 235 | 61 | 73 | 82 | 19 | +12.3% |
| 3 | INTEL CORPORATION | 229 | 62 | 70 | 84 | 13 | +20.0% |
| 4 | TEXAS INSTRUMENTS INCORPORATED | 124 | 23 | 45 | 46 | 10 | +2.2% |
| 5 | Taiwan Semiconductor Manufacturing Co., Ltd. | 122 | 34 | 38 | 47 | 3 | +23.7% |
| 6 | Micron Technology, Inc. | 118 | 34 | 42 | 29 | 13 | -31.0% |
| 7 | Mitsubishi Electric Corporation | 114 | 31 | 36 | 34 | 13 | -5.6% |
| 8 | FUJI ELECTRIC CO., LTD. | 98 | 29 | 31 | 29 | 9 | -6.5% |
| 9 | ROHM CO., LTD. | 91 | 33 | 29 | 26 | 3 | -10.3% |
| 10 | Adeia Semiconductor Bonding Technologies Inc. | 88 | 21 | 26 | 31 | 10 | +19.2% |
| 11 | International Business Machines Corporation | 73 | 19 | 19 | 29 | 6 | +52.6% |
| 12 | Taiwan Semiconductor Manufacturing Company Limited | 66 | 16 | 16 | 30 | 4 | +87.5% |
| 13 | Resonac Corporation | 57 | 6 | 21 | 25 | 5 | +19.0% |
| 14 | SHINKO ELECTRIC INDUSTRIES CO., LTD. | 57 | 15 | 20 | 18 | 4 | -10.0% |
| 15 | NANYA TECHNOLOGY CORPORATION | 56 | 16 | 19 | 19 | 2 | 0.0% |
| 16 | Applied Materials, Inc. | 55 | 10 | 23 | 17 | 5 | -26.1% |
| 17 | CHANGXIN MEMORY TECHNOLOGIES, INC. | 54 | 22 | 12 | 19 | 1 | +58.3% |
| 18 | InnoLux Corporation | 54 | 17 | 17 | 16 | 4 | -5.9% |
| 19 | Infineon Technologies AG | 48 | 15 | 16 | 16 | 1 | 0.0% |
| 20 | ASM IP Holding B.V. | 40 | 13 | 9 | 16 | 2 | +77.8% |
| 21 | DENSO CORPORATION | 39 | 10 | 11 | 16 | 2 | +45.5% |
| 22 | KABUSHIKI KAISHA TOSHIBA | 38 | 11 | 9 | 15 | 3 | +66.7% |
| 23 | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC | 37 | 10 | 11 | 14 | 2 | +27.3% |
| 24 | SK hynix Inc. | 37 | 9 | 8 | 11 | 9 | +37.5% |
| 25 | RENESAS ELECTRONICS CORPORATION | 36 | 13 | 8 | 11 | 4 | +37.5% |