ACM RESEARCH (SHANGHAI), INC.

The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value P 11 and continue with a period T 11 ; step 3: when the period Tn ends, adjusting the first plating power supply applied on the first anode to output a power value P 12 and continue with a period T 12 , at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value P 21 and continue with a period T 21 ; and step 4: when the period T 21 ends, adjusting the second plating power supply applied on the second anode to output a power value P 22 and continue with a period T 22 , wherein step 2 to step 4 are performed periodically.

Disclosed is a substrate processing method, which comprises the following steps: S 1 : transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S 2 : after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S 3 : electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.

The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value P 11 and continue with a period T 11 ; step 3: when the period T 11 ends, adjusting the first plating power supply applied on the first anode to output a power value P 12 and continue with a period T 12 , at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value P 21 and continue with a period T 21 ; and step 4: when the period T 21 ends, adjusting the second plating power supply applied on the second anode to output a power value P 22 and continue with a period T 22 ; wherein step 2 to step 4 are performed periodically.

An apparatus removes particles or photoresist on substrates. The apparatus includes a bench module, configured to implement one or more substrates bench cleaning process; a single module, having multiple single chambers configured to implement single substrate cleaning and drying process; and a process robot, configured to transfer the one or more substrates between the bench module and the single module. The bench module has at least one DIO 3 bath configured to accommodate DIO 3 solution for processing the one or more substrates, at least one SPM bath configured to accommodate SPM solution for processing the one or more substrates, at least one DIW bath configured to accommodate DIW for rinsing the one or more substrates, and at least one second substrate transfer robot configured to transfer the one or more substrates among the DIO 3 bath, the SPM bath and the DIW bath.

The present invention discloses an electroplating apparatus, comprising: a membrane frame, the center of which is provided with a through hole; transport branch pipes, extending from the side wall of the through hole of the membrane frame to the edge of the membrane frame; a plating solution buffer structure, comprising a central cap and a flow stabilizing sleeve, the central cap being provided on the through hole of the membrane frame and covering the through hole; a plurality of first holes being formed on the top of the central cap, the flow stabilizing sleeve being fixed below the central cap and inserted in the through hole of the membrane frame, and at least one second hole being formed in the side wall of the flow stabilizing sleeve; and a diffusion plate being fixed to the top of the membrane frame and provided with a plurality of third holes. A cathode plating solution flows into the space between the flow stabilizing sleeve and the side wall of the through hole through the transport branch pipes, then enters the interior of the flow stabilizing sleeve through the second holes on the side wall of the flow stabilizing sleeve, and then is supplied to the diffusion plate through the first holes in the central cap and reaches the substrate through the third holes. The present invention can buffer the flow speed of the fluid, thus effectively solving the problem of differentiation between the center and the edge of the substrate to be electroplated, and improving the quality of the electroplating product.

Methods and an apparatus for removing particles or photoresist on substrates. In an embodiment, a method comprises the following steps: transferring one or more substrates into a DIO 3 solution accommodated in a DIO 3 bath; after the one or more substrates are processed in the DIO 3 bath, taking the one or more substrates out from the DIO 3 bath and transferring the one or more substrates into a SPM solution accommodated in a SPM bath; after the one or more substrates are processed in the SPM bath, taking the one or more substrates out from the SPM bath and rinsing the one or more substrates; and transferring the one or more substrates to one or more single chambers to perform single substrate cleaning and drying process. The method combines DIO 3 and SPM in one cleaning sequence, which can remove particles or photoresist, especially remove photoresist treated by medium dose or high dose of ion implantation.

A coating and developing device comprises a front end module ( 100 ), a process station ( 200 ), and an interface station ( 300 ) that are successively connected, wherein the process station ( 200 ) comprises a coating unit ( 210 ), a developing unit ( 220 ), at least one transversely moving of mobile conveying part ( 230 ), and at least one side robot (R 0 ). After a substrate has been processed in the coating unit ( 210 ), the substrate is transferred to the mobile conveying part ( 230 ) by the at least one side robot (R 0 ), and the substrate is transferred to the interface station ( 300 ) by the mobile conveying part ( 230 ). After the substrate has been processed in the developing unit ( 220 ), the substrate is transferred to the mobile conveying part ( 230 ) by the at least one side robot (R 0 ), and the substrate is transferred to the front end module ( 100 ) by the mobile conveying part ( 230 ). The mobile conveying part ( 230 ) and the side robot (R 0 ) are configured to be responsible for transferring the substrate between the front end module ( 100 ) and the interface station ( 300 ) reducing the operating load of the robot in the coating unit ( 210 ) or the developing unit ( 220 ), and improving the throughput of the coating and developing device.

A substrate processing apparatus includes a clamp mechanism, a spray head mechanism, a rotary drive mechanism, a heating mechanism, and a control mechanism. The heating mechanism includes a heating plate arranged below a substrate, wherein the heating plate is provided with at least two cavities in a radial direction, and the cavities are distributed at different radii. During the process of the liquid nozzle moving from the center of the substrate to the edge of the substrate along the radial direction of the substrate, when the liquid nozzle moves to a certain area above the substrate, the control mechanism controls the thermal energy of fluid in the cavity located at the corresponding radius of the area.

An electroplating device includes a process chamber, a paddle plate and a driving mechanism. The driving mechanism is used for driving the paddle plate to move back and forth to make the paddle plate stir the electroplating solution in the process chamber when a substrate is electroplated. The electroplating device further includes a cleaning assembly and a connecting bracket. The cleaning assembly is used for spraying a cleaning solution onto the electroplated substrate. One end of the connecting bracket is connected to the paddle plate, and the other end of the connecting bracket is connected to the driving mechanism, and the driving mechanism drives the paddle plate to move back and forth via the connecting bracket. The connecting bracket is opened with a hollowed-out area, and the cleaning solution sprayed onto the substrate is collected after passing through the hollowed-out area.

Disclosed is a substrate processing method, which comprises the following steps: S 1: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S 2: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S 3: electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.