ASML Holding N.V.

A metrology system includes a radiation source, first, second, and third optical systems, and a processor. The first optical system splits the radiation into first and second beams of radiation and imparts one or more phase differences between the first and second beams. The second optical system directs the first and second beams toward a target structure to produce first and second scattered beams of radiation. The third optical system interferes the first and second scattered beams at an imaging detector. The imaging detector generates a detection signal based on the interfered first and second scattered beams. The metrology system modulates one or more phase differences of the first and second scattered beams based on the imparted one or more phase differences. The processor analyzes the detection signal to determine a property of the target structure based on at least the modulated one or more phase differences.

A metrology system includes a radiation source ( 708 ), a phased array ( 722 a,b; 724 a,b; 726;734 ), a detector, and a comparator. The phased array includes optical elements ( 706 ), waveguides ( 704 ), and phase modulators ( 702 ). The phased array generates a beam of radiation and directs the beam toward a surface of an object. The optical elements radiate radiation waves. The waveguides guide radiation from the radiation source to the optical elements. The phase modulators adjust phases of the radiation waves such that the radiation waves combine to form the beam. The detector receives radiation scattered from the surface and generates a detection signal based on the received radiation. The comparator analyzes the detection signal and determines a location of a defect on the surface based on the analyzing.

A metrology system ( 400 ) includes a multi-source radiation system. The multi-source radiation system includes a waveguide device ( 502 ) and the multi-source radiation system is configured to generate one or more beams of radiation. The metrology system ( 400 ) further includes a coherence adjuster ( 500 ) including a multimode waveguide device ( 504 ). The multimode waveguide device ( 504 ) includes an input configured to receive the one or more beams of radiation from the multi-source radiation system ( 514 ) and an output ( 518 ) configured to output a coherence adjusted beam of radiation for irradiating a target ( 418 ). The metrology system ( 400 ) further includes an actuator ( 506 ) coupled to the waveguide device ( 502 ) and configured to actuate the waveguide device ( 502 ) so as to change an impingement characteristic of the one or more beams of radiation at the input of the multimode waveguide device ( 504 ).

Systems, apparatuses, and methods are provided for adjusting illumination slit uniformity in a lithographic apparatus. An example method can include irradiating, by a radiation source, a portion of a finger assembly with radiation. The example method can further include receiving, by a radiation detector, at least a portion of the radiation in response to the irradiating of the portion of the finger assembly. The example method can further include determining, by a processor, a change in a shape of the finger assembly based on the received radiation. The example method can further include generating, by the processor, a control signal configured to modify a position of the finger assembly based on the determined change in the shape of the finger assembly. Subsequently, the example method can include transmitting, by the processor, the control signal to a motion control system coupled to the finger assembly.

An optical filter apparatus including an optical divergence device, operable to receive optical pulses and spatially distribute the optical pulses over an optical plane in dependence with a pulse energy of each of the optical pulses; and a spatial filter, located at the optical plane, operable to apply spatial filtering to the optical pulses based on a location of each of the optical pulses at the optical plane resulting from the spatial distributing.

A structure of a semiconductor device with a sub-segmented grating structure as a metrology mark and a method for configuring the metrology mark. The method for configuring a metrology mark may be used in a lithography process. The method may include determining an initial characteristic function of an initial metrology mark disposed within a layer stack. The method also includes perturbing one or more variables of the plurality of subsegments of the metrology mark (e.g., pitch, duty cycle, and/or line width of the plurality of subsegments) and further perturbing a thickness of one or more layers within the layer stack. The method further includes iteratively performing the perturbations until a minimized characteristic function of an initial metrology mark is determined to set a configuration for the plurality of subsegments.

A metrology system includes a radiation source, first, second, and third optical systems, and a processor. The first optical system splits the radiation into first and second beams of radiation and impart one or more phase differences between the first and second beams. The second optical system directs the first and second beams toward a target structure to produce first and second scattered beams of radiation. The third optical system interferes the first and second scattered beams at an imaging detector. The imaging detector generates a detection signal based on the interfered first and second scattered beams. The metrology system modulates one or more phase differences of the first and second scattered beams based on the imparted one or more phase differences. The processor analyzes the detection signal to determine a property of the target structure based on at least the modulated one or more phase differences.

A lithographic apparatus includes an illumination system to illuminate a pattern of a patterning device, a projection system to project an image of the pattern onto a substrate, a movable stage to support the patterning device or the substrate, a slotted object, and a locking device ( 700 ) to prevent a motion of the movable stage. The locking device comprises an actuator ( 702 ) and a wheel device ( 704 ) comprising a ring feature ( 708 ) and coupled to the actuator. The actuator rotates the wheel device about a rotation axis ( 706 ). The ring feature has a width ( 710 ) defined parallel to the rotation axis. The width is variable with respect to azimuthal direction of the wheel device. The ring feature engages a slot of the slotted object. The rotating adjusts the width of the ring feature within the slot such that a relative motion between the device and the slotted object is prevented.

A radiation source arrangement including: a radiation source operable to generate source radiation including source energy pulses; and at least one non-linear energy-filter operable to filter the source radiation to obtain filtered radiation including filtered energy pulses. The at least one non-linear energy-filter is operable to mitigate variation in energy in the filtered radiation by reducing the energy level of the source energy pulses which have an energy level corresponding to one of both extremities of an energy distribution of the source energy pulses by a greater amount than the source energy pulses which have an energy level corresponding to a peak of the energy distribution.

A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.