Avary Holding (Shenzhen) Co., Ltd.

A circuit board includes a first circuit base board, a second circuit base board, an annular interposer disposed between the first circuit base board and the second circuit base board, and a conductive element. A first annular groove of the first circuit base board has a first internal extension groove. A second annular groove of the second circuit base board has a second internal extension groove. The annular interposer is located in the first annular groove and the second annular groove. The conductive element is disposed in the first internal extension groove and the second internal extension groove and electrically connects the first conductive layer and the second conductive layer.

A bio-implantable device and a fabricating method of the same are provided. The bio-implantable device includes a flexible circuit board, a sensor, an elastic conductive layer, an electrode structure, and an elastic insulating layer. The flexible circuit board includes a wiring layer. The sensor is disposed on the wiring layer. The elastic conductive layer covers the sensor. The electrode structure is disposed on the elastic conductive layer and is configured to collect an electric signal from a creature. The electrode structure is electrically connected to the sensor through the elastic conductive layer. The elastic insulating layer covers the flexible circuit board and exposes the electrode structure and the elastic conductive layer.

A pressure sensor and method of manufacturing the same are provided. The pressure sensor includes a flexible sensor board. The flexible sensor board includes a dielectric layer, two circuit layers and piezoelectric sensing blocks. The dielectric layer has a first surface and a second surface opposite to the first surface. The two circuit layers are placed on the first surface and the second surface of the dielectric layer respectively. The piezoelectric sensing blocks are placed in dielectric layer and electrically connected with the two circuit layers. The mentioned pressure sensor utilizes the flexible sensor board that can be suitable for to the curvature of the diffident curved surfaces of the tested sample, which helps to improve the consistency and accuracy of the measurements.

A bendable circuit board includes a first structure and a second structure. The first structure includes a first insulation layer, a first insulation extension material, a first conductive layer and a first conductive extension feature. The first insulation extension material surrounds the first insulation layer. The first conductive layer includes a first conductive feature and a second conductive feature. The first conductive extension feature connects the first conductive feature to the second conductive feature. The second structure is bonded to the first structure, and includes a second insulation layer, a second insulation extension material, a second conductive layer and a second conductive extension feature. The second insulation extension material surrounds the second insulation layer. The second conductive layer includes a third conductive feature and a fourth conductive feature. The second conductive extension feature connects the third conductive feature to the fourth conductive feature.

A circuit board having a switch includes an insulation material layer, first and second insulation layers, a circular channel, a first cover layer, an inert liquid material, a first conductive block, a second conductive block and a conductive layer. The first and second insulation layers are respectively on bottom and top surfaces of the insulation material layer. The circular channel is in the first and second insulation layers and the insulation material layer, and includes a first sub-channel, a second sub-channel, a first connection channel and a second connection channel. The first cover layer is on a bottom surface of the first insulation layer. The inert liquid material is in the circular channel. The first conductive block is in the first sub-channel. The second conductive block is in the second sub-channel. The conductive layer is in the insulation material layer and adjacent to the circular channel.

A transducer wiring board includes a movable unit, a fixing unit, plural suspensions, plural X-axis actuators, and plural Y-axis actuators. The movable unit includes a first movable section and plural second movable sections. The second movable sections are disposed on two sides of the first movable section along a Y axial direction. The fixing unit is spaced apart from the movable unit and includes plural fixing sections. The fixing sections are disposed on another two sides of the first movable section along an X axial direction. Each suspension connects the movable unit and the fixing unit. Each X-axis actuator connects one of the fixing sections and the first movable section. Each Y-axis actuator connects the first movable section and one of the second movable section.

A circuit board and a fabricating method of the same are provided. The circuit board includes multiple first wiring layers, a plated through hole, a filling material, a cover wiring layer, a second wiring layer and a conductive structure. The plated through hole extends through the first wiring layers and is electrically connected to the first wiring layers. The filling material is disposed in the plated through hole. The cover wiring layer covers the plated through hole and is electrically connected to the plated through hole. The second wiring layer is stacked on the first wiring layers and the cover wiring layer. The conductive structure extends through the cover wiring layer to the filling material from the second wiring layer and is inserted in the filling material. The conductive structure does not penetrate the filling material.

A radio frequency transmission circuit board has a bending portion, a signal transmitting portion and a signal receiving portion, and includes a first multilayer structure, a second multilayer structure, a third multilayer structure, a blind hole, a lens and an optical fiber. The blind hole extends from the second multilayer structure to the first multilayer structure. A reflective layer is arranged in the blind hole. The lens is embedded in the first multilayer structure and partially exposed in the blind hole. The optical fiber is embedded in the first multilayer structure and connected to the lens. The bending portion does not include the second multilayer structure and the third multilayer structure. The blind hole and the lens are located in the signal transmitting portion. The optical fiber is located in the bending portion.

An electronic module and a method of manufacturing the same are provided. The electronic module includes an interposer, a first electronic component, a flexible circuit board, and a second electronic component. The interposer includes a Redistribution Layer (RDL), and a main body layer. The main body layer is disposed on the RDL and has a recess exposing the RDL. The first electronic component is embedded in the recess of the interposer and electrically connected with the RDL. The flexible circuit board wraps the interposer and the first electronic component. The second electronic component is disposed on the flexible circuit board and overlaps the first electronic component.

A transmission line structure and a fabricating method of the same are provided. The transmission line structure includes a baseboard, two transmission lines, a grounding plate, a metal plate, a shielding element, and an elastic conductor. The baseboard has an air hole. The transmission lines are spaced side by side, and are disposed on the baseboard. The grounding plate is separated from the transmission lines, and is disposed on the baseboard. The metal plate is separated from the baseboard. The transmission lines are located between the baseboard and the metal plate. The shielding element is disposed on the metal plate and extends toward the baseboard. The elastic conductor is disposed between the baseboard and the metal plate, and is electrically connected to the grounding plate and the metal plate. The baseboard, the metal plate, and the elastic conductor define a transmission cavity that communicates with the air hole.