Avary Holding (Shenzhen) Co., Ltd.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Measures force or pressure by detecting changes in electrical capacitance. This typically involves the deformation of a dielectric material or the relative movement of conductive plates, altering the distance or area between them.

Sensors and systems designed to detect and quantify localized contact forces, pressure distribution, or touch interactions, often employed in robotics, human-machine interfaces, or object manipulation applications.

Systems and sensors designed to measure the pressure difference between two distinct points or to capture rapid, transient pressure fluctuations in fluid or gas systems, often using diaphragms or pistons.

Development of polymer compositions and material structures for electrical insulation and protective sheathing of cables, focusing on properties like flame retardancy, flexibility, and semiconductivity.

Mechanical structures and devices designed to support, stabilize, or mount cameras and related photographic equipment, often featuring quick-release mechanisms, damping, or adjustable components.

Utilizes optical fibers, often incorporating Fiber Bragg Gratings (FBG), to detect changes in strain, pressure, or temperature based on modifications to light signals (e.g., wavelength shifts, phase changes) transmitted through the fiber.

Sensors that quantify strain or deformation by measuring the change in electrical resistance of a material, such as a semiconductor film or conductive layers, as it undergoes mechanical stress.