Company patents

Empower Semiconductor, Inc.

Empower Semiconductor, Inc. exhibits a highly concentrated patent strategy, with 92.1% of its portfolio in Power Conversion (DC/AC, DC/DC), a category that saw a significant 50.0% growth in 2025. While its core focus remains strong, the company also shows an emerging interest in Power Distribution & Storage, which experienced a 100.0% year-over-year growth in 2025, suggesting a strategic expansion beyond pure conversion technologies, despite the partial data for 2026 showing a decline in all categories so far.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

63 US filings (since 2023) · 5 categories · 8 themes

Advanced Power Converter Topologies

Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.

Power Conversion (DC/AC, DC/DC)
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55since 2023
+75.0%YoY
Power Switching & Drivers

Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.

Pulse / Digital Logic Circuits
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21since 2023
-14.3%YoY
Control & Stability for Power Converters

Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.

Power Conversion (DC/AC, DC/DC)
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19since 2023
+166.7%YoY
3D Die Stacking & Vertical Interconnects

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Semiconductor Packaging & Encapsulation
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3since 2023
new
Modular & Hybrid Power Supply Systems

Design and control of power supply architectures that combine multiple power sources (e.g., AC grid, DC battery, generators) or modular battery units, often featuring switching, conversion, and redundancy for enhanced reliability and flexibility.

Power Distribution & Storage
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2since 2023
new
Advanced Package Interconnects

Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.

Semiconductor Packaging & Encapsulation
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2since 2023
0.0%YoY
High-Density Magnetic Component Integration

Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.

Magnets & Inductors
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2since 2023
0.0%YoY
Power Systems with Energy Storage & Grid Interaction

Integration of power converters with energy storage devices (batteries, supercapacitors) or grid interfaces, often involving AC/DC conversion, power flow management, and fault handling for hybrid power systems or specific applications like EVs or PV.

Power Conversion (DC/AC, DC/DC)
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1since 2023
n/a

Patents

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