Company patents
Empower Semiconductor, Inc.
Empower Semiconductor, Inc. demonstrates a highly concentrated patent strategy, with an overwhelming 92.3% of its portfolio in Power Conversion (DC/AC, DC/DC), which saw a significant 50.0% growth in 2025. While this core area remains dominant, the company also shows an emerging focus on Power Distribution & Storage, which experienced a rapid 100.0% year-over-year growth in 2025, suggesting a strategic expansion within the broader electrical power sector, despite partial data for 2026 showing declines across most categories.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
65 US filings (since 2023) · 6 categories · 9 themes
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.
Design and control of power supply architectures that combine multiple power sources (e.g., AC grid, DC battery, generators) or modular battery units, often featuring switching, conversion, and redundancy for enhanced reliability and flexibility.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Techniques for efficiently supplying power to electronic devices, managing battery charge/discharge cycles, optimizing power consumption, and converting power between different voltage levels or AC/DC for improved energy efficiency and longevity.
Integration of power converters with energy storage devices (batteries, supercapacitors) or grid interfaces, often involving AC/DC conversion, power flow management, and fault handling for hybrid power systems or specific applications like EVs or PV.
Patents
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Advanced Package Interconnects