Company patents
ENKRIS SEMICONDUCTOR, INC.
ENKRIS SEMICONDUCTOR, INC. shows a surprising shift in its patent strategy, with a significant decline in filings across several core semiconductor categories in 2025 and so far in 2026, such as Transistor & Device Structure (down 93.5% in 2025 and 100.0% in 2026) and Integrated Circuit Layout & Arrangement (down 81.2% in 2025 and 100.0% in 2026), despite a strong focus on Semiconductor Manufacturing Process (27.0% of portfolio). However, there's an emerging focus on Coating & Surface Treatment and Impedance Networks (Filters, Resonators), both showing a 100.0% year-over-year growth in 2026, indicating a potential diversification or refinement of their materials and component-level innovations.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
270 US filings (since 2023) · 12 categories · 22 themes
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Innovations in the internal design of individual light-emitting diode chips or packages, focusing on semiconductor layer arrangements, electrode configurations, reflective elements, and light extraction features.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Development and manufacturing of semiconductor devices using wide bandgap materials like Silicon Carbide (SiC) or Gallium Nitride (GaN) for high-power, high-frequency, or high-temperature applications.
Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.
Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.
Focuses on the design and manufacturing of transistors where the gate material fully encircles the channel, often using nanosheets or fins, to improve electrostatic control and reduce short-channel effects.
Optical structures and lens designs that improve light extraction efficiency from LED dies and modules, including diffractive films, micro-lens arrays, reflectors, and color-conversion layers.
Incorporation of novel semiconductor, dielectric, or metallic materials into transistor structures to achieve enhanced performance, new functionalities, or specific device characteristics.
Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.
Techniques for manufacturing semiconductor laser chips, including active region design, mirror structures, current and optical confinement, and the integration of multiple layers or elements on a substrate.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Layout, material composition, and structural arrangement of photoelectric conversion elements and associated circuitry within image sensor arrays, including infrared detectors and back-side illuminated structures.
Techniques and structural designs for assembling multiple display modules or panels to create a larger, continuous display with minimized visible seams, uniform light emission, and robust mechanical integrity.
Devices utilizing piezoelectric materials to generate and filter acoustic waves, often for radio frequency applications, including surface acoustic wave (SAW) and bulk acoustic wave (BAW) structures.
Methods and structures for assembling laser chips into functional modules, encompassing optical alignment, electrical interconnection, mechanical support, thermal management, and encapsulation for protection.
Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
LED devices and display systems designed to emit or utilize light across different spectral ranges, including visible and invisible light, or to create specific illumination patterns and immersive lighting experiences.
Specialized design and fabrication of light-emitting diodes specifically engineered to produce light in the deep ultraviolet (DUV) spectrum, often for applications like sterilization or curing.
Methods and structures for encapsulating, interconnecting, and integrating impedance network components, particularly acoustic filters, into larger modules or systems.
Patents
Showing 1-8 of 8
Image Sensor Pixel & Array Design