FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

A light-emitting device includes a light-emitting assembly, a first adhesive film, and a second adhesive film. The light-emitting assembly includes a first PCB substrate, a first light-emitting chip, and second light-emitting chips. The first PCB substrate has a mounting surface on one side of the first PCB substrate. The first light-emitting chip and the second light-emitting chips are disposed on the mounting surface. The light emission angle of the first light-emitting chip is less than the light emission angle of each of the second light-emitting chips. The first adhesive film is disposed on the mounting surface. The first adhesive film covers the first light-emitting chip. The second adhesive film covers the second light-emitting chip. The second adhesive film covers and is connected to the light-emitting assembly and the first adhesive film. The refractive index of the first adhesive film is greater than the refractive index of the second adhesive film.

Provided are a method for machining a device and the device. The method for machining a device includes die bonding, primary dicing, filling by a baffle wall material, grinding and secondary dicing. In the step of grinding machining, a semi-finished product is placed on a platform surface of a grinding and fixing platform, a grinding working end of a grinding device is controlled to operate, and with the platform surface of the grinding and fixing platform as a height reference, the grinding working end grinds from above the semi-finished product toward the grinding and fixing platform and operates to a preset height. Through the special machining process, the probability of the appearance of white glue on a top surface of the device is reduced, which is conducive to ensuring a production yield of the device.

An ambient light bar includes: a printed circuit board (PCB) board; at least one beveled light emitting diode (LED) bead group and a lens assembly. The beveled LED bead group includes at least two beveled LED beads, and the at least two beveled LED beads are fixed on the PCB board according to a preset arrangement. A bevel angle is formed between a chip mounting face and a welding plane of each of the beveled LED beads, and the bevel angles of the at least two beveled LED beads are different. The lens assembly is covered above a light output side of the beveled LED bead group and is fixed on the PCB board.

Provided are a bracket and a LED device. The bracket includes a lead frame and a molded structure connected to the lead frame. The lead frame includes a first lead portion, a second lead portion, and a barrier structure. The first lead portion includes a first base. The second lead portion includes a second base spaced from the first base. A gap between the first base and the second base forms a channel. The barrier structure is disposed on a side of at least one of the first base or the second base facing the channel. The barrier structure is disposed between two opposite ends of the first base and/or the second base and protrudes from the first base and/or the second base, and a length between two opposite ends of the channel is greater than a length of a middle part so that a “wide-narrow-wide” pattern is formed.

Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.

A substrate module includes a first substrate on which pad groups and a test terminal are disposed; a driver chip disposed on a side of the first substrate facing away from the pad groups and the test terminal, where the driver chip is connected to the pad groups and the test terminal separately; a second substrate disposed on a side of the driver chip facing away from the first substrate, where pins are disposed on a side of the second substrate facing away from the first substrate, and the driver chip is connected to the pins; and a filling layer disposed between the first substrate and the second substrate and configured to enclose the driver chip.

An image display device with an ambient light strip assembly includes a back plate and a light strip assembly. The light strip assembly includes a first light group disposed horizontally, a second light group disposed vertically, a first corner light group, and a second corner light group. The first corner light group and the second corner light group are located between the first light group and the second light group. The first corner light group includes more than two auxiliary light beads. One auxiliary light bead is adjacent to the second corner light group, the remaining auxiliary light beads are arranged in sequence toward the first edge, the vertical distance between the auxiliary light bead adjacent to the second corner light group and the first edge is greater than the vertical distance between the auxiliary light bead on the other side and the first edge.

A method for die bonding an LED chip includes S1: forming a preset adhesive droplet array corresponding to one pad on a substrate based on the area S of one LED chip and the radius R of an adhesive droplet formed by a dispensing device in a single dispensing action, where parameters of the preset adhesive droplet array include the number X of adhesive droplets in a horizontal direction, the number Y of adhesive droplets in a vertical direction, and a horizontal distance H between two horizontally adjacent adhesive droplets, and a vertical distance D between two vertically adjacent adhesive droplets; S2: dispensing a conductive adhesive onto the pad multiple times according to the preset adhesive droplet array to form a bonding portion; and S3: placing the LED chip on the bonding portion and curing the conductive adhesive.

An image display device with an ambient light strip assembly includes a back plate and a light strip assembly. The light strip assembly includes a first light group disposed horizontally, a second light group disposed vertically, a first corner light group, and a second corner light group. The first corner light group and the second corner light group are located between the first light group and the second light group. The first corner light group includes more than two auxiliary light beads. One auxiliary light bead is adjacent to the second corner light group, the remaining auxiliary light beads are arranged in sequence toward the first edge, the vertical distance between the auxiliary light bead adjacent to the second corner light group and the first edge is greater than the vertical distance between the auxiliary light bead on the other side and the first edge.

A light-emitting diode (LED) device and module with a large light emission angle include a substrate, an LED chip, a fluorescent adhesive layer, and a shielding layer, where the LED chip is electrically connected to the substrate; the fluorescent adhesive layer wraps and covers a light-emitting surface of the LED chip; the shielding layer tightly covers a top surface of the fluorescent adhesive layer enabling part of the light emitted by the LED chip to be reflected to the side surfaces of the fluorescent adhesive layer and emitted out from the LED device with a large light emission angle; and an interface between the fluorescent adhesive layer and the shielding layer is a curved surface.