FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

A light-emitting device includes a light-emitting assembly, a first adhesive film, and a second adhesive film. The light-emitting assembly includes a first PCB substrate, a first light-emitting chip, and second light-emitting chips. The first PCB substrate has a mounting surface on one side of the first PCB substrate. The first light-emitting chip and the second light-emitting chips are disposed on the mounting surface. The light emission angle of the first light-emitting chip is less than the light emission angle of each of the second light-emitting chips. The first adhesive film is disposed on the mounting surface. The first adhesive film covers the first light-emitting chip. The second adhesive film covers the second light-emitting chip. The second adhesive film covers and is connected to the light-emitting assembly and the first adhesive film. The refractive index of the first adhesive film is greater than the refractive index of the second adhesive film.

Provided are a method for machining a device and the device. The method for machining a device includes die bonding, primary dicing, filling by a baffle wall material, grinding and secondary dicing. In the step of grinding machining, a semi-finished product is placed on a platform surface of a grinding and fixing platform, a grinding working end of a grinding device is controlled to operate, and with the platform surface of the grinding and fixing platform as a height reference, the grinding working end grinds from above the semi-finished product toward the grinding and fixing platform and operates to a preset height. Through the special machining process, the probability of the appearance of white glue on a top surface of the device is reduced, which is conducive to ensuring a production yield of the device.

Provided are a bracket and a LED device. The bracket includes a lead frame and a molded structure connected to the lead frame. The lead frame includes a first lead portion, a second lead portion, and a barrier structure. The first lead portion includes a first base. The second lead portion includes a second base spaced from the first base. A gap between the first base and the second base forms a channel. The barrier structure is disposed on a side of at least one of the first base or the second base facing the channel. The barrier structure is disposed between two opposite ends of the first base and/or the second base and protrudes from the first base and/or the second base, and a length between two opposite ends of the channel is greater than a length of a middle part so that a “wide-narrow-wide” pattern is formed.

Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.

A substrate module includes a first substrate on which pad groups and a test terminal are disposed; a driver chip disposed on a side of the first substrate facing away from the pad groups and the test terminal, where the driver chip is connected to the pad groups and the test terminal separately; a second substrate disposed on a side of the driver chip facing away from the first substrate, where pins are disposed on a side of the second substrate facing away from the first substrate, and the driver chip is connected to the pins; and a filling layer disposed between the first substrate and the second substrate and configured to enclose the driver chip.

A method for die bonding an LED chip includes S1: forming a preset adhesive droplet array corresponding to one pad on a substrate based on the area S of one LED chip and the radius R of an adhesive droplet formed by a dispensing device in a single dispensing action, where parameters of the preset adhesive droplet array include the number X of adhesive droplets in a horizontal direction, the number Y of adhesive droplets in a vertical direction, and a horizontal distance H between two horizontally adjacent adhesive droplets, and a vertical distance D between two vertically adjacent adhesive droplets; S2: dispensing a conductive adhesive onto the pad multiple times according to the preset adhesive droplet array to form a bonding portion; and S3: placing the LED chip on the bonding portion and curing the conductive adhesive.

A substrate includes a substrate body and a top copper layer disposed on the substrate body. Multiple insulated channels are disposed on the top copper layer. The top copper layer forms a top circuit structure based on the multiple insulated channels. A light-emitting element installation region is disposed on the top layer circuit structure. The top copper layer in the light-emitting element installation region protrudes upward to form at least one copper layer boss. Multiple light-emitting element welding positions are disposed in the light-emitting element installation region. A light-emitting element welding position is disposed on any copper layer boss. The copper layer boss is configured to adjust the height of the light emission surface of a light-emitting element disposed in the light-emitting element installation region.

A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step S 1 and step S 2 . In step S 1 , a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S 2 , conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.

The disclosure provides a full-color light emitting device and a display module. A light emitting layer, a refractive layer, a spacer layer and a light processing layer are included. The refractive layer is disposed above the light emitting layer, the spacer layer is disposed above the refractive layer, and the light processing layer is disposed above the spacer layer. The light emitting layer includes a first light emitting part, a second light emitting part and a third light emitting part. The light processing layer includes a first light processing part, a second light processing part, and a third light processing part, and a baffle wall is disposed between any two adjacent light processing parts in the first light processing part, the second light processing part and the third light processing part. A light refractive index of the refractive layer is greater than a light refractive index of the spacer layer.

The disclosure provides a light-emitting device and a displayer. Herein, the light-emitting device includes a substrate, a light-emitting chip, a first light-transmitting layer, a second light-transmitting layer and a nano coating. The light transmittance of the second light-transmitting layer is greater than the light transmittance of the first light-transmitting layer. A reference surface corresponding to the light-emitting chip is arranged above the substrate, and the reference surface is higher than the bottom surface of the light-emitting chip and not higher than the top surface of the light-emitting chip. The first light-transmitting layer covers the surface of the light-emitting chip below the reference surface, and the second light-transmitting layer covers the surface of the light-emitting chip above the reference surface. The nano coating covers the outer surface of the first light-transmitting layer, the outer surface of the second light-transmitting layer and the side surface of the substrate.