Company patents
Frore Systems Inc.
Frore Systems Inc. demonstrates a strong historical focus on semiconductor technologies, with Printed Circuits & Electronic Assemblies making up 68.4% of its portfolio. However, a surprising shift is evident with significant year-over-year declines across nearly all categories in 2025 and so far in 2026, including a complete cessation of patenting in Pumps (Positive Displacement) and Pumps (Centrifugal) in 2026, indicating a potential re-evaluation of its core R&D priorities, despite a 100% YoY increase in Telephone Equipment patents so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
98 US filings (since 2023) · 12 categories · 14 themes
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.
Heat transfer devices that utilize the phase change of a working fluid (evaporation and condensation) to efficiently move heat, often incorporating capillary structures, heat pipes, or vapor chambers.
Design and integration of thermoelectric modules for converting heat into electricity (power generation) or using electricity for cooling/heating, often involving p-type/n-type semiconductor pellets and waste heat recovery.
Techniques and structures within heat exchangers designed to enhance heat transfer efficiency by controlling and optimizing fluid flow, including baffle arrangements, jet impingement, and condensate management.
Design and functionality of external components, peripherals, and mounting solutions that enhance, protect, or integrate with mobile electronic devices, such as modular cases, docking stations, and specialized mounts.
Mechanical and thermal package design for LED modules, including heat sinks, thermal pads, flexible PCBs, and component housings for heat dissipation.
Systems and methods for dynamically adjusting light output, distribution, color, or intensity based on environmental conditions, user presence, content, or specific application needs.
Optical structures and lens designs that improve light extraction efficiency from LED dies and modules, including diffractive films, micro-lens arrays, reflectors, and color-conversion layers.
Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.
Mechanisms and control systems for precisely moving valve elements, often involving electric motors, cams, solenoids, or pneumatic/hydraulic pilots, to achieve desired flow or position.
Methods and components for converting power into mechanical motion to drive pump mechanisms, encompassing electric motors, hydraulic actuators, and specialized motion converters like ball screws or solenoids.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Focuses on the design, fabrication, and application of piezoelectric materials and devices for sensing, actuation, or wave generation, including material properties, single crystal growth, and protective layers.
Patents
Showing 111-120 of 138