Company patents

Frore Systems Inc.

Frore Systems Inc. demonstrates a clear focus on semiconductor-related cooling technologies, with "Printed Circuits & Electronic Assemblies" accounting for a dominant 67.4% of its portfolio. While there was a significant surge in patenting activity in 2024 across categories like "Semiconductor Packaging & Encapsulation" (+100% YoY) and "Inorganic Devices (Thermoelectric, Piezo)" (+125% YoY), patent filings have seen a sharp decline across most categories in 2025 and so far in 2026, including a complete halt in "Pumps (Positive Displacement)" and "Refrigeration" filings in 2026, suggesting a potential shift in R&D priorities or a maturation of their core patenting efforts.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

92 US filings (since 2023) · 12 categories · 14 themes

Package Thermal Management

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Semiconductor Packaging & Encapsulation
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66since 2023
-13.0%YoY
Advanced Heat Exchanger Architectures

Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.

Heat Exchange Components
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64since 2023
-4.2%YoY
Two-Phase Cooling Devices

Heat transfer devices that utilize the phase change of a working fluid (evaporation and condensation) to efficiently move heat, often incorporating capillary structures, heat pipes, or vapor chambers.

Heat Exchange Components
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40since 2023
+50.0%YoY
Thermoelectric Cooling & Power Generation

Design and integration of thermoelectric modules for converting heat into electricity (power generation) or using electricity for cooling/heating, often involving p-type/n-type semiconductor pellets and waste heat recovery.

Inorganic Devices (Thermoelectric, Piezo)
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14since 2023
-40.0%YoY
Internal Flow Path Optimization

Techniques and structures within heat exchangers designed to enhance heat transfer efficiency by controlling and optimizing fluid flow, including baffle arrangements, jet impingement, and condensate management.

Heat Exchange Components
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12since 2023
0.0%YoY
Mobile Device Accessories & Integration

Design and functionality of external components, peripherals, and mounting solutions that enhance, protect, or integrate with mobile electronic devices, such as modular cases, docking stations, and specialized mounts.

Telephone Equipment
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4since 2023
-66.7%YoY
LED Module Thermal Packaging

Mechanical and thermal package design for LED modules, including heat sinks, thermal pads, flexible PCBs, and component housings for heat dissipation.

Lighting Devices (Functional Features)
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4since 2023
-50.0%YoY
Adaptive Lighting Control Systems

Systems and methods for dynamically adjusting light output, distribution, color, or intensity based on environmental conditions, user presence, content, or specific application needs.

Lighting Devices (Functional Features)
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2since 2023
+100.0%YoY
LED Optical Extraction & Light Management

Optical structures and lens designs that improve light extraction efficiency from LED dies and modules, including diffractive films, micro-lens arrays, reflectors, and color-conversion layers.

Lighting Devices (Functional Features)
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2since 2023
+100.0%YoY
Flexible/Foldable Device Structures

Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.

Telephone Equipment
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2since 2023
0.0%YoY
Advanced Valve Actuation

Mechanisms and control systems for precisely moving valve elements, often involving electric motors, cams, solenoids, or pneumatic/hydraulic pilots, to achieve desired flow or position.

Valves
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2since 2023
0.0%YoY
Integrated Actuation and Drive Systems

Methods and components for converting power into mechanical motion to drive pump mechanisms, encompassing electric motors, hydraulic actuators, and specialized motion converters like ball screws or solenoids.

Pumps (Positive Displacement)
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2since 2023
n/a
Advanced Electronic Packaging

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
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1since 2023
n/a
Piezoelectric Transducers & Films

Focuses on the design, fabrication, and application of piezoelectric materials and devices for sensing, actuation, or wave generation, including material properties, single crystal growth, and protective layers.

Inorganic Devices (Thermoelectric, Piezo)
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1since 2023
n/a

Patents

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